Inventor · disambiguated record
Yoshio Hagiwara
Also filed as: HAGIWARA YOSHIO
21 granted patents·2 pending applications·369 citations·filing 1978–2008
96Inventor score
Files withTOKYO OHKA KOGYO CO LTD17HAGIWARA YOSHIO1RICOH KK1SHINETSU HANDOTAI KK1TOKYO OHKA KOGYO LTD1
Top patents by PatentIndex Score
23 records- 0190US6515073B2Anti-reflective coating-forming compositionTOKYO OHKA KOGYO CO LTD·Filed 2001·Granted Feb 4, 2003·54 cites·5 claims
- 0286US5496402AMethod and liquid coating composition for the formation of silica-based coating film on substrate surfaceTOKYO OHKA KOGYO CO LTD·Filed 1994·Granted Mar 5, 1996·43 cites·12 claims
- 0383US7135064B2Silica-based coating film on substrate and coating solution thereforTOKYO OHKA KOGYO CO LTD·Filed 2005·Granted Nov 14, 2006·8 cites·6 claims
- 0479US5762697ACoating solution for silica-based coating film and method for the preparation thereofTOKYO OHKA KOGYO CO LTD·Filed 1996·Granted Jun 9, 1998·33 cites·7 claims
- 0577US5885654APolysilazane-based coating solution for interlayer insulationTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted Mar 23, 1999·56 cites·18 claims
- 0676US8021968B2Susceptor and method for manufacturing silicon epitaxial waferSHINETSU HANDOTAI KK·Filed 2008·Granted Sep 20, 2011·5 cites·5 claims
- 0774US6338868B1Method for the formation of a siliceous coating filmTOKYO OHKA KOGYO CO LTD·Filed 2000·Granted Jan 15, 2002·15 cites·12 claims
- 0869US7498520B2Semiconductor multilayer wiring board and method of forming the sameUNIV WASEDA·Filed 2004·Granted Mar 3, 2009·16 cites·9 claims
- 0969US5614271AMethod for the formation of a silica-based coating filmTOKYO OHKA KOGYO CO LTD·Filed 1996·Granted Mar 25, 1997·39 cites·6 claims
- 1062US6214104B1Coating solution for forming silica coating and method of forming silica coatingTOKYO OHKA KOGYO CO LTD·Filed 1996·Granted Apr 10, 2001·21 cites·20 claims
- 1155US6190788B1Method for the formation of a siliceous coating filmTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted Feb 20, 2001·17 cites·2 claims
- 1253US6074962AMethod for the formation of silica-based coating filmTOKYO OHKA KOGYO CO LTD·Filed 1998·Granted Jun 13, 2000·18 cites·10 claims
- 1347US6995096B2Method for forming multi-layer wiring structureTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Feb 7, 2006·1 cites·1 claims
- 1447US5614251AMethod and liquid coating composition for the formation of silica-based coating film on substrate surfaceTOKYO OHKA KOGYO CO LTD·Filed 1995·Granted Mar 25, 1997·10 cites·3 claims
- 1546US6875262B1Silica-based coating film on substrate and coating solution thereforTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted Apr 5, 2005·11 cites·9 claims
- 1644US4155762ALiquid developer for binary diazo copying materialsRICOH KK·Filed 1978·Granted May 22, 1979·3 cites·7 claims
- 1742US6767839B1Method for forming multi-layer wiring structureTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted Jul 27, 2004·9 cites·6 claims
- 1842US6723633B2Method for forming multi-layer wiring structureTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Apr 20, 2004·0 cites·1 claims
- 1941US5457153ALiquid coating compositionTOKYO OHKA KOGYO CO LTD·Filed 1994·Granted Oct 10, 1995·4 cites·4 claims
- 2039US5795378ACoating solution for silica-based coating film and method for the preparation thereofTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted Aug 18, 1998·4 cites·12 claims
- 2139US2005112383A1Undercoating layer material for lithography and wiring forming method using the sameFiled 2004·Application pending·0 cites
- 2238US2006141693A1Semiconductor multilayer interconnection forming methodHAGIWARA YOSHIO·Filed 2003·Application pending·0 cites
- 2330US6503825B1Method for forming multi-layer wiring structureTOKYO OHKA KOGYO LTD·Filed 1998·Granted Jan 7, 2003·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →