Inventor · disambiguated record
Yoshitomo Hashimoto
Also filed as: HASHIMOTO YOSHITOMO
64 granted patents·27 pending applications·78 citations·filing 2012–2025
98Inventor score
Top patents by PatentIndex Score
91 records- 0196US11527402B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0296US11417518B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0393US11935742B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·1 cites·21 claims
- 0493US10770287B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·6 cites·18 claims
- 0593US9620357B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 11, 2017·8 cites·14 claims
- 0692US9054046B2Method of manufacturing semiconductor device and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 9, 2015·10 cites·20 claims
- 0791US11515143B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 0890US11626280B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 11, 2023·1 cites·19 claims
- 0988US11817314B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 14, 2023·1 cites·20 claims
- 1088US9460911B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·4 cites·10 claims
- 1187US9218959B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 22, 2015·6 cites·14 claims
- 1286US12400874B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·23 claims
- 1386US11961733B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 16, 2024·1 cites·23 claims
- 1486US10229829B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·3 cites·2 claims
- 1585US12283478B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 22, 2025·0 cites·21 claims
- 1685US8785333B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 22, 2014·6 cites·17 claims
- 1785US2025285878A1Apparatus for etching baseKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1885US2025349533A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1983US12009201B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jun 11, 2024·0 cites·22 claims
- 2083US9583338B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Feb 28, 2017·5 cites·17 claims
- 2182US12278103B2Method of processing substrate and method of manufacturing semiconductor device by forming filmKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 15, 2025·0 cites·22 claims
- 2281US12406843B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 2, 2025·0 cites·26 claims
- 2381US12288684B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 2481US2025226204A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2580US11183382B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 23, 2021·2 cites·21 claims
- 2680US10163625B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 25, 2018·2 cites·11 claims
- 2780US2025391678A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2878US11967499B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·0 cites·23 claims
- 2978US11894239B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 6, 2024·0 cites·21 claims
- 3078US2024242961A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3177US9704703B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 11, 2017·3 cites·19 claims
- 3276US11164741B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 2, 2021·1 cites·21 claims
- 3376US2025299948A1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3475US11664217B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 3575US2025246427A1Processing apparatus, processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3673US12424437B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·23 claims
- 3773US12381091B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 5, 2025·0 cites·21 claims
- 3873US11315800B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 3972US12033852B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 4072US11056337B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 4172US10626502B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 21, 2020·1 cites·15 claims
- 4272US10600642B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 24, 2020·1 cites·19 claims
- 4372US9837261B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 5, 2017·1 cites·12 claims
- 4472US2025226207A1Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4571US12424463B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 4671US11978623B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 4771US11848203B2Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 19, 2023·0 cites·24 claims
- 4871US11823886B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 21, 2023·0 cites·21 claims
- 4971US9881789B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 30, 2018·1 cites·10 claims
- 5071US2025299949A1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
Showing the top 50 of 91 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →