Inventor · disambiguated record
Yoshio Homma
Also filed as: HOMMA YOSHIO
46 granted patents·7 pending applications·2,117 citations·filing 1976–2010
99Inventor score
Top patents by PatentIndex Score
53 records- 0199US5609511APolishing methodHITACHI LTD·Filed 1995·Granted Mar 11, 1997·413 cites·13 claims
- 0298US6117775APolishing methodHITACHI LTD·Filed 1998·Granted Sep 12, 2000·254 cites·50 claims
- 0397US4717462ASputtering apparatusHITACHI LTD·Filed 1986·Granted Jan 5, 1988·102 cites·11 claims
- 0496US6562719B2Methods of polishing, interconnect-fabrication, and producing semiconductor devicesHITACHI LTD·Filed 2001·Granted May 13, 2003·88 cites·20 claims
- 0595US4897709ATitanium nitride film in contact hole with large aspect ratioHITACHI LTD·Filed 1988·Granted Jan 30, 1990·151 cites·12 claims
- 0695US4599135AThin film depositionHITACHI LTD·Filed 1984·Granted Jul 8, 1986·82 cites·28 claims
- 0793US6899603B2Polishing apparatusRENESAS TECH CORP·Filed 2004·Granted May 31, 2005·37 cites·14 claims
- 0892US6561883B1Method of polishingHITACHI LTD·Filed 2000·Granted May 13, 2003·59 cites·21 claims
- 0991US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 1091US6774041B1Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·52 cites·21 claims
- 1190US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 1289US6596638B1Polishing methodHITACHI LTD·Filed 2000·Granted Jul 22, 2003·33 cites·41 claims
- 1388US5772780APolishing agent and polishing methodHITACHI LTD·Filed 1995·Granted Jun 30, 1998·68 cites·22 claims
- 1488US4539616AThin film magnetic head and fabricating method thereofHITACHI LTD·Filed 1982·Granted Sep 3, 1985·31 cites·13 claims
- 1587US6750128B2Methods of polishing, interconnect-fabrication, and producing semiconductor devicesRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·34 cites·12 claims
- 1686US6565422B1Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatusHITACHI LTD·Filed 2000·Granted May 20, 2003·29 cites·21 claims
- 1786US6509273B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 21, 2003·36 cites·45 claims
- 1886US6043155APolishing agent and polishing methodHITACHI LTD·Filed 1998·Granted Mar 28, 2000·56 cites·2 claims
- 1985US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 2084US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 2182US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 2281US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 2381US6561875B1Apparatus and method for producing substrate with electrical wire thereonHITACHI LTD·Filed 2000·Granted May 13, 2003·20 cites·26 claims
- 2480US6719618B2Polishing apparatusRENESAS TECH CORP·Filed 2001·Granted Apr 13, 2004·17 cites·15 claims
- 2579US5270259AMethod for fabricating an insulating film from a silicone resin using O.sub.HITACHI LTD·Filed 1991·Granted Dec 14, 1993·69 cites·25 claims
- 2679US5175017AMethod of forming metal or metal silicide filmHITACHI LTD·Filed 1991·Granted Dec 29, 1992·43 cites·57 claims
- 2778US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 2875US5177589ARefractory metal thin film having a particular step coverage factor and ratio of surface roughnessHITACHI LTD·Filed 1991·Granted Jan 5, 1993·54 cites·8 claims
- 2973US7279425B2Polishing methodHITACHI LTD·Filed 2006·Granted Oct 9, 2007·2 cites·27 claims
- 3073US6180020B1Polishing method and apparatusHITACHI LTD·Filed 1995·Granted Jan 30, 2001·46 cites·24 claims
- 3171US6815357B2Process and apparatus for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·16 cites·25 claims
- 3271US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 3371US6478977B1Polishing method and apparatusHITACHI LTD·Filed 2000·Granted Nov 12, 2002·15 cites·12 claims
- 3463US4842891AMethod of forming a copper film by chemical vapor depositionHITACHI LTD·Filed 1988·Granted Jun 27, 1989·27 cites·11 claims
- 3560US7132367B2Polishing methodHITACHI LTD·Filed 2003·Granted Nov 7, 2006·4 cites·58 claims
- 3657US4073054AMethod of fabricating semiconductor deviceHITACHI LTD·Filed 1976·Granted Feb 14, 1978·16 cites·1 claims
- 3756US7563716B2Polishing methodRENESAS TECH CORP·Filed 2007·Granted Jul 21, 2009·0 cites·5 claims
- 3856US6855035B2Apparatus and method for producing substrate with electrical wire thereonRENESAS TECH CORP·Filed 2002·Granted Feb 15, 2005·5 cites·42 claims
- 3954US7183212B2Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 27, 2007·3 cites·18 claims
- 4052US4710398ASemiconductor device and manufacturing method thereofHITACHI LTD·Filed 1986·Granted Dec 1, 1987·17 cites·10 claims
- 4149US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 4249US7026245B2Polishing agent and polishing methodRENESAS TECH CORP·Filed 2003·Granted Apr 11, 2006·1 cites·23 claims
- 4347US6676496B2Apparatus for processing semiconductor wafersHITACHI LTD·Filed 2001·Granted Jan 13, 2004·2 cites·10 claims
- 4447US6221773B1Method for working semiconductor waferHITACHI LTD·Filed 1996·Granted Apr 24, 2001·12 cites·16 claims
- 4547US2005170760A1Polishing apparatusFiled 2005·Application pending·0 cites
- 4645US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 4742US2004171264A1Methods of polishing, interconnect-fabrication, and producing semiconductor devicesRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 4841US5444000AMethod of fabricating integrated circuit with improved yield rateHITACHI LTD·Filed 1994·Granted Aug 22, 1995·12 cites·25 claims
- 4941US2002068452A1Polishing agent and polishing methodFiled 2000·Application pending·0 cites
- 5040US2002025605A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →