Inventor · disambiguated record
Yong Woo Hong
Also filed as: HONG YONG W · HONG YONG WOO
3 granted patents·4 pending applications·18 citations·filing 2007–2010
65Inventor score
Top patents by PatentIndex Score
7 records- 0178US7863758B2Adhesive film composition, associated dicing die bonding film, and die packageCHEIL IND INC·Filed 2007·Granted Jan 4, 2011·11 cites·20 claims
- 0267US8211540B2Adhesive film composition, associated dicing die bonding film, die package, and associated methodsHONG YONG WOO·Filed 2008·Granted Jul 3, 2012·6 cites·23 claims
- 0362US8394493B2Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the sameHONG YONG WOO·Filed 2007·Granted Mar 12, 2013·1 cites·10 claims
- 0446US2008108721A1Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methodsHA KYOUNG J·Filed 2007·Application pending·0 cites
- 0540US2009162650A1Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methodsHONG YONG WOO·Filed 2008·Application pending·0 cites
- 0637US2008063871A1Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor packageJUNG KI S·Filed 2007·Application pending·0 cites
- 0732US2011151207A1Die adhesive film, reel for die adhesive film, mounting apparatus and electronic device comprising the sameHONG YONG WOO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →