Inventor · disambiguated record
Yoshihiro Hosoi
Also filed as: HOSOI YOSHIHIRO
10 granted patents·2 pending applications·73 citations·filing 1985–2023
86Inventor score
Top patents by PatentIndex Score
12 records- 0177US9426887B2Wiring board and electronic device using the sameKyocera slc tech corp·Filed 2013·Granted Aug 23, 2016·4 cites·8 claims
- 0271US8890001B2Wiring board and mounting structure using the sameKYOCERA SLC TECHNOLOGIES CORP·Filed 2013·Granted Nov 18, 2014·4 cites·8 claims
- 0368US8735741B2Circuit board and mounting structure using the sameHARAZONO MASAAKI·Filed 2011·Granted May 27, 2014·3 cites·7 claims
- 0468US4626479ACovering metal structure for metallized metal layer in electronic partKYOCERA CORP·Filed 1985·Granted Dec 2, 1986·44 cites·6 claims
- 0559US8957321B2Printed circuit board, mount structure thereof, and methods of producing theseKYOCERA SLC TECHNOLOGIES CORP·Filed 2012·Granted Feb 17, 2015·1 cites·15 claims
- 0648US11823966B2Wiring substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Nov 21, 2023·0 cites·18 claims
- 0748US11792930B2Wiring substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2020·Granted Oct 17, 2023·0 cites·14 claims
- 0846US6841885B2Wiring substrateKYOCERA CORP·Filed 2002·Granted Jan 11, 2005·2 cites·7 claims
- 0946US2025159799A1Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2023·Application pending·0 cites
- 1042US5760466ASemiconductor device having improved heat resistanceKYOCERA CORP·Filed 1997·Granted Jun 2, 1998·15 cites·10 claims
- 1141US7011862B2Method for producing wiring substrateKYOCERA CORP·Filed 2004·Granted Mar 14, 2006·0 cites·8 claims
- 1241US2023403793A1Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →