Inventor · disambiguated record
You Chye How
Also filed as: HOW YOU CHYE
19 granted patents·11 pending applications·119 citations·filing 2004–2024
93Inventor score
Top patents by PatentIndex Score
30 records- 0193US7749809B2Methods and systems for packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Jul 6, 2010·37 cites·14 claims
- 0289US8048781B2Methods and systems for packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 1, 2011·22 cites·19 claims
- 0384US8030138B1Methods and systems of packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 4, 2011·14 cites·17 claims
- 0481US7863757B2Methods and systems for packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2010·Granted Jan 4, 2011·6 cites·9 claims
- 0581US7582954B1Optical leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Sep 1, 2009·11 cites·7 claims
- 0672US9620388B2Integrated circuit package fabrication with die attach paddle having middle channelsTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 11, 2017·3 cites·6 claims
- 0769US8018050B2Integrated circuit package with integrated heat sinkNAT SEMICONDUCTOR CORP·Filed 2007·Granted Sep 13, 2011·5 cites·24 claims
- 0868US9202778B2Integrated circuit package with die attach paddle having at least one recessed portionTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 1, 2015·3 cites·6 claims
- 0962US11837518B2Coated semiconductor diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 5, 2023·0 cites·19 claims
- 1061US9123626B1Integrated passive flip chip packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 1, 2015·2 cites·16 claims
- 1161US2025372576A1Semiconductor device package with stub leads and methodsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1260US6972244B1Marking semiconductor devices through a mount tapeNAT SEMICONDUCTOR CORP·Filed 2004·Granted Dec 6, 2005·12 cites·5 claims
- 1359US11830791B2Leads for leadframe and semiconductor packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 28, 2023·0 cites·28 claims
- 1458US11328984B2Multi-die integrated circuit packages and methods of manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2017·Granted May 10, 2022·1 cites·16 claims
- 1557US10079162B1Method for making lead frames for integrated circuit packagesTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 18, 2018·0 cites·19 claims
- 1657US8647966B2Method and apparatus for dicing die attach film on a semiconductor waferLIM KEN FEI·Filed 2011·Granted Feb 11, 2014·3 cites·12 claims
- 1755US9978613B1Method for making lead frames for integrated circuit packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted May 22, 2018·0 cites·19 claims
- 1855US2025309063A1Shaped die for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1954US2015108626A1Multilevel LeadframeTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2053US10804114B2Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sidesTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 13, 2020·0 cites·15 claims
- 2151US2014346656A1Multilevel LeadframeTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2250US2024339382A1Molded package with an interchangeable leadframeTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2350US2024347425A1Integrated circuit package with multiple interconnectsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2446US2015053586A1Carrier tapeTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2545US7868433B2Low stress cavity packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Jan 11, 2011·0 cites·14 claims
- 2645US2015262920A1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 2743US10381293B2Integrated circuit package having an IC die between top and bottom leadframesTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 13, 2019·0 cites·19 claims
- 2843US2008242003A1Integrated circuit devices with integral heat sinksNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 2942US2015035130A1Integrated Circuit with Stress IsolationTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3041US2017053883A1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →