Inventor · disambiguated record
Yongqi Hu
Also filed as: HU YONGQI
35 granted patents·25 pending applications·330 citations·filing 2001–2023
97Inventor score
Top patents by PatentIndex Score
60 records- 0193US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 0291US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 0391US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 0488US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 0587US7084064B2Full sequence metal and barrier layer electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 1, 2006·14 cites·29 claims
- 0686US12330260B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2023·Granted Jun 17, 2025·0 cites·10 claims
- 0786US7229535B2Hydrogen bubble reduction on the cathode using double-cell designsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 12, 2007·25 cites·20 claims
- 0883US7582564B2Process and composition for conductive material removal by electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Sep 1, 2009·9 cites·20 claims
- 0982US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 1081US11161218B2Window in thin polishing padAPPLIED MATERIALS INC·Filed 2019·Granted Nov 2, 2021·1 cites·13 claims
- 1181US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 1279US11826875B2Window in thin polishing padAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 1379US7569134B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2006·Granted Aug 4, 2009·5 cites·7 claims
- 1479US7344431B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·5 cites·21 claims
- 1578US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 1678US7077721B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Jul 18, 2006·17 cites·31 claims
- 1776US11618124B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·0 cites·15 claims
- 1876US7699972B2Method and apparatus for evaluating polishing pad conditioningAPPLIED MATERIALS INC·Filed 2006·Granted Apr 20, 2010·2 cites·18 claims
- 1976US6709314B2Chemical mechanical polishing endpoinat detectionAPPLIED MATERIALS INC·Filed 2001·Granted Mar 23, 2004·17 cites·22 claims
- 2075US10213894B2Method of placing window in thin polishing padAPPLIED MATERIALS INC·Filed 2016·Granted Feb 26, 2019·1 cites·1 claims
- 2175US7125477B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2002·Granted Oct 24, 2006·14 cites·67 claims
- 2273US7232514B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·15 cites·63 claims
- 2371US7374644B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted May 20, 2008·13 cites·58 claims
- 2471US6790768B2Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defectsAPPLIED MATERIALS INC·Filed 2001·Granted Sep 14, 2004·13 cites·40 claims
- 2568US2009036032A1Temperature control for ecmp processHU YONGQI·Filed 2008·Application pending·0 cites
- 2666US10744618B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2017·Granted Aug 18, 2020·0 cites·20 claims
- 2765US10029346B2External clamp ring for a chemical mechanical polishing carrier headAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·1 cites·20 claims
- 2863US2024417340A1Method for preparing porous ceramic coated with metal coating, and aerosol generation apparatusSHENZHEN WOODY VAPES TECH CO LTD·Filed 2022·Application pending·0 cites
- 2961US2007227901A1Temperature control for ECMP processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3060US9731397B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2015·Granted Aug 15, 2017·0 cites·20 claims
- 3159US6960521B2Method and apparatus for polishing metal and dielectric substratesAPPLIED MATERIALS INC·Filed 2004·Granted Nov 1, 2005·6 cites·34 claims
- 3257US8961266B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2013·Granted Feb 24, 2015·0 cites·23 claims
- 3355US9744640B2Corrosion resistant retaining ringsAPPLIED MATERIALS INC·Filed 2015·Granted Aug 29, 2017·0 cites·14 claims
- 3455US7446041B2Full sequence metal and barrier layer electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 4, 2008·0 cites·13 claims
- 3555US7303662B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 4, 2007·4 cites·72 claims
- 3653US2007151867A1Apparatus and a method for electrochemical mechanical processing with fluid flow assist elementsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3752US10399202B2Retaining ring for lower wafer defectsAPPLIED MATERIALS INC·Filed 2016·Granted Sep 3, 2019·0 cites·8 claims
- 3851US2008108288A1Conductive Polishing Article for Electrochemical Mechanical PolishingHU YONGQI·Filed 2007·Application pending·0 cites
- 3949US2005178666A1Methods for fabrication of a polishing articleAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4048US2007295611A1Method and composition for polishing a substrateLIU FENG Q·Filed 2007·Application pending·0 cites
- 4147US2007153453A1Fully conductive pad for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4245US2008293343A1Pad with shallow cells for electrochemical mechanical processingWANG YUCHUN·Filed 2007·Application pending·0 cites
- 4345US2007131562A1Method and apparatus for planarizing a substrate with low fluid consumptionAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4444US7576007B2Method for electrochemically mechanically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Aug 18, 2009·0 cites·16 claims
- 4544US2008156657A1Conductive polishing article for electrochemical mechanical polishingBUTTERFIELD PAUL D·Filed 2008·Application pending·0 cites
- 4643US7678245B2Method and apparatus for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 16, 2010·0 cites·26 claims
- 4743US2007144915A1Process and composition for passivating a substrate during electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4843US2004248412A1Method and composition for fine copper slurry for low dishing in ECMPFiled 2004·Application pending·0 cites
- 4943US2007218587A1Soft conductive polymer processing pad and method for fabricating the sameAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 5043US2007254485A1Abrasive composition for electrochemical mechanical polishingMAO DAXIN·Filed 2007·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →