Inventor · disambiguated record
Yoshihiro Ihara
Also filed as: IHARA YOSHIHIRO
23 granted patents·2 pending applications·281 citations·filing 1997–2020
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US8419442B2Socket and method of fabricating the sameHORIKAWA YASUYOSHI·Filed 2011·Granted Apr 16, 2013·42 cites·11 claims
- 0295US8179692B2Board having connection terminalIHARA YOSHIHIRO·Filed 2010·Granted May 15, 2012·25 cites·17 claims
- 0393US7220657B2Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted May 22, 2007·90 cites·16 claims
- 0488US8294253B2Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structureIHARA YOSHIHIRO·Filed 2010·Granted Oct 23, 2012·11 cites·12 claims
- 0587US11322478B2Semiconductor device and semiconductor device arraySHINKO ELECTRIC IND CO·Filed 2020·Granted May 3, 2022·2 cites·7 claims
- 0685US7972149B2Board with connection terminalsSHINKO ELECTRIC IND CO·Filed 2010·Granted Jul 5, 2011·5 cites·10 claims
- 0781US8827730B2Socket and semiconductor device provided with socketIHARA YOSHIHIRO·Filed 2011·Granted Sep 9, 2014·12 cites·17 claims
- 0879US6413404B1Method of forming bumps by electroplatingSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 2, 2002·25 cites·11 claims
- 0978US8083529B2SocketIHARA YOSHIHIRO·Filed 2011·Granted Dec 27, 2011·4 cites·16 claims
- 1071US8152535B2Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting boardIHARA YOSHIHIRO·Filed 2011·Granted Apr 10, 2012·7 cites·13 claims
- 1169US10257934B2Circuit board moduleSHINKO ELECTRIC IND CO·Filed 2018·Granted Apr 9, 2019·1 cites·9 claims
- 1269US8784118B2Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrateIHARA YOSHIHIRO·Filed 2012·Granted Jul 22, 2014·6 cites·5 claims
- 1367US6030512ADevice for forming bumps by metal platingSHINKO ELECTRIC IND CO·Filed 1998·Granted Feb 29, 2000·26 cites·6 claims
- 1463US8735737B2Substrate having leadsIHARA YOSHIHIRO·Filed 2010·Granted May 27, 2014·2 cites·20 claims
- 1561US10319963B2Battery and method for producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 11, 2019·0 cites·12 claims
- 1661US9716053B2Semiconductor device, heat conductor, and method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Jul 25, 2017·1 cites·4 claims
- 1754US10588533B2Bioelectrode componentSHINKO ELECTRIC IND CO·Filed 2018·Granted Mar 17, 2020·0 cites·19 claims
- 1851US6184567B1Film capacitor and semiconductor package or device carrying sameSHINKO ELECTRIC IND CO·Filed 1997·Granted Feb 6, 2001·18 cites·10 claims
- 1950US6667235B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2000·Granted Dec 23, 2003·4 cites·3 claims
- 2047US9508670B2Semiconductor device including semiconductor chips stacked via relay substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 29, 2016·0 cites·8 claims
- 2141US10219745B2Sensor including a peelable insulation sheetNIHON KOHDEN CORP·Filed 2016·Granted Mar 5, 2019·0 cites·18 claims
- 2241US2013048359A1Substrate with spring terminal and method of manufacturing the sameIHARA YOSHIHIRO·Filed 2012·Application pending·0 cites
- 2340US9245856B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 26, 2016·0 cites·24 claims
- 2439US11309224B2Folded substrate for stacked integrated circuit devicesSHINKO ELECTRIC IND CO·Filed 2018·Granted Apr 19, 2022·0 cites·6 claims
- 2536US2015262957A1Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →