Inventor · disambiguated record
Yoshinari Ikeda
Also filed as: IKEDA YOSHINARI
57 granted patents·6 pending applications·143 citations·filing 2007–2024
97Inventor score
Files withFUJI ELECTRIC CO LTD52FUJI ELEC DEVICE TECH CO LTD2WISCONSIN ALUMNI RES FOUND2FUJI ELECTRIC SYSTEMS CO LTD1HORI MOTOHITO1
Top patents by PatentIndex Score
63 records- 0191US8450845B2Semiconductor deviceIKEDA YOSHINARI·Filed 2009·Granted May 28, 2013·29 cites·4 claims
- 0290US9059009B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2012·Granted Jun 16, 2015·11 cites·16 claims
- 0388US10163868B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 25, 2018·7 cites·16 claims
- 0488US9305910B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Apr 5, 2016·6 cites·5 claims
- 0587US9673129B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jun 6, 2017·6 cites·9 claims
- 0686US8907477B2Unit for semiconductor device and semiconductor deviceYAMADA TAKAFUMI·Filed 2010·Granted Dec 9, 2014·7 cites·10 claims
- 0784US11410922B2Semiconductor device comprising a capacitorFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 0884US7705443B2Semiconductor device with lead frame including conductor plates arranged three-dimensionallyFUJI ELEC DEVICE TECH CO LTD·Filed 2007·Granted Apr 27, 2010·14 cites·19 claims
- 0983US11444004B2CoolerFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·9 claims
- 1083US11075144B2Cooler and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 27, 2021·2 cites·11 claims
- 1183US2025029916A1Semiconductor device comprising a capacitorFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1282US12142559B2Semiconductor device comprising a capacitorFUJI ELECTRIC CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·5 claims
- 1382US9761567B2Power semiconductor module and composite moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Sep 12, 2017·4 cites·15 claims
- 1480US10867980B2Semiconductor equipmentFUJI ELECTRIC CO LTD·Filed 2019·Granted Dec 15, 2020·4 cites·10 claims
- 1579US11521925B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Dec 6, 2022·1 cites·13 claims
- 1679US9590622B1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·9 claims
- 1778US10128166B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Nov 13, 2018·3 cites·15 claims
- 1877US11887925B2Semiconductor device comprising a capacitorFUJI ELECTRIC CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·15 claims
- 1976US7888173B2Semiconductor device manufacturing methodFUJI ELEC DEVICE TECH CO LTD·Filed 2009·Granted Feb 15, 2011·7 cites·16 claims
- 2074US9854708B2Unit for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Dec 26, 2017·2 cites·12 claims
- 2173US8836080B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2013·Granted Sep 16, 2014·3 cites·8 claims
- 2272US9786587B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Oct 10, 2017·2 cites·20 claims
- 2372US9287187B2Power semiconductor moduleYANAGAWA KATSUHIKO·Filed 2012·Granted Mar 15, 2016·4 cites·1 claims
- 2471US12451454B2Manufacturing method of packaging structure for bipolar transistor with constricted bumpsFUJI ELECTRIC CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·6 claims
- 2571USD827591SSemiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 4, 2018·16 cites·1 claims
- 2671US9209099B1Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 8, 2015·2 cites·11 claims
- 2769US8673691B2Method for manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Mar 18, 2014·2 cites·6 claims
- 2864US11705419B2Packaging structure for bipolar transistor with constricted bumpsFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·13 claims
- 2963US12394681B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·14 claims
- 3062US2025079413A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3161US10636740B2Semiconductor device, method for manufacturing semiconductor device, and interface unitFUJI ELECTRIC CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·13 claims
- 3261US2025029939A1Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3360US9406603B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Aug 2, 2016·1 cites·11 claims
- 3460US2024304537A1Electronic deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3559US12489031B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·14 claims
- 3659US11531075B2Method and apparatus for integrating current sensors in a power semiconductor moduleWISCONSIN ALUMNI RES FOUND·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3758US12438056B2Semiconductor device and method for determining deterioration of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·17 claims
- 3858US12080612B2Semiconductor device having an insulating sheet and a conductive film, and method of manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·7 claims
- 3958US2024178113A1Electronic device and electronic device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 4056US2023411313A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 4155US12191245B2Semiconductor device having a curved part in the printed circuit boardFUJI ELECTRIC CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·14 claims
- 4255US11664342B2Semiconductor device with a laser-connected terminalFUJI ELECTRIC CO LTD·Filed 2021·Granted May 30, 2023·0 cites·12 claims
- 4353US11315854B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·12 claims
- 4451US11545409B2Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·17 claims
- 4551US11335660B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2021·Granted May 17, 2022·0 cites·10 claims
- 4650US11658231B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 4750US11251163B2Semiconductor device having circuit board interposed between two conductor layersFUJI ELECTRIC CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 4849US11417634B2Semiconductor module having an N terminal, A P terminal and an output terminal and method of fabricating the semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·17 claims
- 4949US11398448B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2021·Granted Jul 26, 2022·0 cites·8 claims
- 5048US12471297B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·13 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →