Inventor · disambiguated record
Yoshinori Imai
Also filed as: IMAI YOSHINORI
10 granted patents·7 pending applications·29 citations·filing 2001–2023
83Inventor score
Files withHITACHI INT ELECTRIC INC4KOKUSAI ELECTRIC CORP4HORII SADAYOSHI3SASAKI TAKAFUMI2KURIBAYASHI KOEI1
Top patents by PatentIndex Score
17 records- 0190US8026159B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted Sep 27, 2011·17 cites·8 claims
- 0276US8409352B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusKURIBAYASHI KOEI·Filed 2011·Granted Apr 2, 2013·6 cites·13 claims
- 0374US8415237B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2011·Granted Apr 9, 2013·3 cites·14 claims
- 0460US8580671B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2012·Granted Nov 12, 2013·1 cites·12 claims
- 0560US2023193465A1Substrate processing method, method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0658US8193083B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2008·Granted Jun 5, 2012·1 cites·8 claims
- 0755US2023411145A1Processing method, method of manufacturing semiconductor device, processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0854US2023012668A1Substrate processing apparatus, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and inner tubeKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0954US2023005760A1Substrate processing apparatus, inner tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1053US11118252B2Galvannealed steel sheetNIPPON STEEL CORP·Filed 2018·Granted Sep 14, 2021·0 cites·8 claims
- 1145US6821871B2Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Nov 23, 2004·1 cites·12 claims
- 1244US9177799B2Semiconductor device manufacturing method and substrate manufacturing method of forming silicon carbide films on the substrateHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 3, 2015·0 cites·10 claims
- 1339US2010297832A1Semiconductor device manufacturing method, substrate processing apparatus, substrate manufacturing methodHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 1438US8889533B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusSASAKI TAKAFUMI·Filed 2011·Granted Nov 18, 2014·0 cites·16 claims
- 1537US2012214317A1Substrate processing apparatus and method, and semiconductor device manufacturing methodMUROBAYASHI MASAKI·Filed 2012·Application pending·0 cites
- 1636US8450220B2Substrate processing apparatus , method of manufacturing semiconductor device, and method of manufacturing substrateSASAKI TAKAFUMI·Filed 2010·Granted May 28, 2013·0 cites·20 claims
- 1732US2012156886A1Substrate processing apparatus, method of manufacturing substrate, and method of manufacturing semiconductor deviceSHIRAKO KENJI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshinori Imai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →