Inventor · disambiguated record
Yoonha Jung
Also filed as: JUNG YOONHA
8 granted patents·4 pending applications·28 citations·filing 2013–2025
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0191US9425156B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 23, 2016·11 cites·22 claims
- 0283US10825776B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·18 claims
- 0381US9252095B2Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2013·Granted Feb 2, 2016·7 cites·28 claims
- 0479US9659852B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·19 claims
- 0578US11335719B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 0676US10211159B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 0771US11824076B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·19 claims
- 0858US11842945B2Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 0945US2025385208A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1041US2016111347A1Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2015·Application pending·0 cites
- 1137US2015035148A1Semiconductor packages and methods of fabricating the sameLEE HEESEOK·Filed 2014·Application pending·0 cites
- 1228US2016276308A1Thermally enhanced package-on-package structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →