Inventor · disambiguated record
Yosuke Kanaoka
Also filed as: KANAOKA YOSUKE
12 granted patents·21 pending applications·26 citations·filing 2009–2023
85Inventor score
Top patents by PatentIndex Score
33 records- 0191US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 0275US10847471B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2018·Granted Nov 24, 2020·2 cites·7 claims
- 0369US9472519B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebyINTEL CORP·Filed 2015·Granted Oct 18, 2016·1 cites·21 claims
- 0468US11081448B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2017·Granted Aug 3, 2021·1 cites·15 claims
- 0567US9006887B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebySWAMINATHAN RAJASEKARAN·Filed 2009·Granted Apr 14, 2015·2 cites·5 claims
- 0666US12087700B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 0763US11527484B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 0857US12400363B2Device and method for improved fiducial marker detectionINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0957US9793233B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 17, 2017·0 cites·19 claims
- 1057US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 1156US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 1256US2025218959A1Pad design for embedded interconnect bridges in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1356US2025201720A1Methods, systems, apparatus, and articles of manufacture to reduce intermetallic compound formation in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1455US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US2025105222A1High performance microelectronic assemblies including through-silicon via bridges with top die last approachINTEL CORP·Filed 2023·Application pending·0 cites
- 1655US2025218988A1Direct bond interconnect architectures for packaging assembliesINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US2024222219A1Package architectures with heterogeneous integration of various device thicknessesINTEL CORP·Filed 2022·Application pending·0 cites
- 1853US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1953US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 2053US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
- 2153US2025112162A1Deep cavity metallization and fiducial arrangements for embedded die and assembly thereof on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 2252US2025218885A1Patterned mold underfill (muf) films for deep trench fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 2351US11923307B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·18 claims
- 2451US2024111090A1Directly coupled optical interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 2550US2024186279A1In-situ uv cure placement tool for room temperature chip/glass device attachmentINTEL CORP·Filed 2022·Application pending·0 cites
- 2650US2013292838A1Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2013·Application pending·0 cites
- 2748US2023092903A1Methods and apparatus to embed host dies in a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 2847US2023086920A1Dam surrounding a die on a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 2946US11062933B2Die placement and coupling apparatusINTEL CORP·Filed 2018·Granted Jul 13, 2021·0 cites·21 claims
- 3046US2024178151A1Overlying fiducial design for glass placement accuracy improvementINTEL CORP·Filed 2022·Application pending·0 cites
- 3142US2023078395A1Devices and methods to minimize die shift in embedded heterogeneous architecturesINTEL CORP·Filed 2021·Application pending·0 cites
- 3241US2023089684A1Fiducial for an electronic deviceINTEL CORP·Filed 2021·Application pending·0 cites
- 3334US2014175657A1Methods to improve laser mark contrast on die backside film in embedded die packagesOKA MIHIR A·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →