Inventor · disambiguated record
Yoshihiro Kashiba
Also filed as: KASHIBA YOSHIHIRO
23 granted patents·1 pending application·519 citations·filing 1991–2013
97Inventor score
Files withMITSUBISHI ELECTRIC CORP20ADVANCED DISPLAY KK2MISUBISHI DENKI KABUSHIKI KAIS1MITSUBISHI DENKI KABSUHIKI KAI1
Top patents by PatentIndex Score
24 records- 0194US6741086B2Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatusMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 25, 2004·50 cites·15 claims
- 0289US6633176B2Semiconductor device test probe having improved tip portion and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 14, 2003·47 cites·7 claims
- 0387US6794890B1Test socket, method of manufacturing the test socket, test method using the test socket, and member to be testedMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 21, 2004·48 cites·5 claims
- 0486US7276923B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Oct 2, 2007·12 cites·4 claims
- 0583US6979843B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 27, 2005·39 cites·13 claims
- 0683US6867484B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Mar 15, 2005·39 cites·10 claims
- 0783US6646455B2Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matterMITSUBISHI DENKI KABSUHIKI KAI·Filed 1998·Granted Nov 11, 2003·52 cites·14 claims
- 0882US7274195B2Semiconductor device test probeMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 25, 2007·26 cites·4 claims
- 0982US6888344B2Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matterMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 3, 2005·24 cites·5 claims
- 1079US9236316B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jan 12, 2016·5 cites·12 claims
- 1174US6989681B2Socket for testing a semiconductor device and a connecting sheet used for the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jan 24, 2006·15 cites·12 claims
- 1268US6882069B1Vehicle AC generator with rectifier diode package disposed between cooling platesMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 19, 2005·16 cites·17 claims
- 1368US6461465B2Apparatus for manufacturing liquid crystal panel and method thereofADVANCED DISPLAY KK·Filed 2001·Granted Oct 8, 2002·5 cites·8 claims
- 1462US5609287ASolder material, junctioning method, junction material, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Mar 11, 1997·29 cites·19 claims
- 1562US5153077ACeramic-metal composite substrateMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 6, 1992·31 cites·5 claims
- 1661US6628127B2Probe card for testing semiconductor integrated circuit and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 30, 2003·9 cites·12 claims
- 1759US6885204B2Probe card, and testing apparatus having the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 26, 2005·7 cites·2 claims
- 1858US6190488B1Apparatus for manufacturing liquid crystal panel and method thereofADVANCED DISPLAY KK·Filed 1999·Granted Feb 20, 2001·20 cites·10 claims
- 1958US5251803ACeramic-metal composite substrate and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 12, 1993·27 cites·12 claims
- 2056US6667626B2Probe card, and testing apparatus having the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 23, 2003·6 cites·4 claims
- 2148US7112976B2Test socket, method of manufacturing the test socket, test method using the test socket, and member to be testedMISUBISHI DENKI KABUSHIKI KAIS·Filed 2004·Granted Sep 26, 2006·3 cites·8 claims
- 2242US2005145842A1Socket for testing a semiconductor device and a connecting sheet used for the sameMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 2339US5637917ALead frame assembly for a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 10, 1997·8 cites·11 claims
- 2431US6118172AHigh-frequency circuit device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 12, 2000·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →