Inventor · disambiguated record
Yoshihide Kihara
Also filed as: KIHARA YOSHIHIDE
67 granted patents·38 pending applications·46 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
105 records- 0196US11551937B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Jan 10, 2023·2 cites·36 claims
- 0295US11615964B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Mar 28, 2023·2 cites·30 claims
- 0394US11101138B2Etching methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 24, 2021·3 cites·21 claims
- 0489US10381236B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2018·Granted Aug 13, 2019·5 cites·20 claims
- 0588US12400835B2Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Aug 26, 2025·1 cites·19 claims
- 0688US11450537B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·2 cites·22 claims
- 0788US11244828B2Method for processing workpieceTOKYO ELECTRON LTD·Filed 2020·Granted Feb 8, 2022·2 cites·11 claims
- 0884US9607811B2Workpiece processing methodTOKYO ELECTRON LTD·Filed 2015·Granted Mar 28, 2017·4 cites·9 claims
- 0984US2025046615A1Etching methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1082US12142484B2Etching methodTOKYO ELECTRON LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1182US11798793B2Substrate processing method, component processing method, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Oct 24, 2023·1 cites·17 claims
- 1281US11133192B2Workpiece processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 28, 2021·2 cites·19 claims
- 1381US10553446B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2019·Granted Feb 4, 2020·2 cites·21 claims
- 1481US2025364260A1Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1580US12334343B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2024·Granted Jun 17, 2025·0 cites·18 claims
- 1680US11658036B2Apparatus for processing substrateTOKYO ELECTRON LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 1780US10504745B2Method for processing target objectTOKYO ELECTRON LTD·Filed 2018·Granted Dec 10, 2019·2 cites·15 claims
- 1879US9859126B2Method for processing target objectTOKYO ELECTRON LTD·Filed 2016·Granted Jan 2, 2018·3 cites·15 claims
- 1978US2025349552A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2076US11139175B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2019·Granted Oct 5, 2021·1 cites·15 claims
- 2176US10886136B2Method for processing substratesTOKYO ELECTRON LTD·Filed 2019·Granted Jan 5, 2021·1 cites·14 claims
- 2275US10586710B2Etching methodTOKYO ELECTRON LTD·Filed 2018·Granted Mar 10, 2020·1 cites·17 claims
- 2374US11380551B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·13 claims
- 2473US12387936B2Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·21 claims
- 2573US11961746B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 2673US2025022706A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2773US2025323055A1Etching methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2872US2023035391A1Method for processing substratesTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2971US11367610B2Film forming and process container cleaning methodTOKYO ELECTRON LTD·Filed 2019·Granted Jun 21, 2022·1 cites·19 claims
- 3070US12512325B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Dec 30, 2025·0 cites·16 claims
- 3170US12387941B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·19 claims
- 3270US12071687B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 27, 2024·0 cites·17 claims
- 3370US11495469B2Method for processing substratesTOKYO ELECTRON LTD·Filed 2020·Granted Nov 8, 2022·0 cites·14 claims
- 3469US2023395390A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3569US2023207343A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3667US12412749B2Etching method and plasma processing systemTOKYO ELECTRON LTD·Filed 2023·Granted Sep 9, 2025·0 cites·19 claims
- 3767US11557485B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 17, 2023·0 cites·16 claims
- 3867US11056370B2Method for processing workpieceTOKYO ELECTRON LTD·Filed 2017·Granted Jul 6, 2021·1 cites·3 claims
- 3967US9911607B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2015·Granted Mar 6, 2018·1 cites·10 claims
- 4066US10460963B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2016·Granted Oct 29, 2019·1 cites·6 claims
- 4165US11823903B2Method for processing workpieceTOKYO ELECTRON LTD·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
- 4265US11600501B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 4365US10233535B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2015·Granted Mar 19, 2019·1 cites·9 claims
- 4465US2022301881A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4565US2023268191A1Etching methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4664US12476115B2Method for processing workpieceTOKYO ELECTRON LTD·Filed 2021·Granted Nov 18, 2025·0 cites·16 claims
- 4764US11380555B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 4864US10475659B2Method of processing target objectTOKYO ELECTRON LTD·Filed 2018·Granted Nov 12, 2019·0 cites·18 claims
- 4964US2024006168A1Substrate processing method, component processing method, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 5064US2019214265A1Method of processing target objectTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →