Inventor · disambiguated record
Youngbae Kim
Also filed as: KIM YOUNGBAE
30 granted patents·38 pending applications·218 citations·filing 1992–2024
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD43SOLUS ADVANCED MATERIALS CO LTD4KIM YOUNGBAE3LG ELECTRONICS INC3HWANG MINKYU2
Top patents by PatentIndex Score
68 records- 0194US8852708B2Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation memberKIM YOUNGBAE·Filed 2010·Granted Oct 7, 2014·52 cites·17 claims
- 0293US8871323B2Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation memberKIM YOUNGBAE·Filed 2010·Granted Oct 28, 2014·43 cites·18 claims
- 0392US8986805B2Vacuum insulation panel, refrigerator with vacuum insulation panel and manufacturing method for vacuum insulation panelLG ELECTRONICS INC·Filed 2013·Granted Mar 24, 2015·30 cites·11 claims
- 0491US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0590US9530741B2Semiconductor packages having residual stress layers and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·8 cites·20 claims
- 0687US8822006B2Core of vacuum insulation member and vacuum insulation member using the sameYOON ILSEOB·Filed 2010·Granted Sep 2, 2014·18 cites·9 claims
- 0786US9741668B2Semiconductor packages having residual stress layers and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 22, 2017·5 cites·16 claims
- 0884US9731492B2Substrate peeling apparatus and method of peeling substrate using the sameSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Aug 15, 2017·10 cites·10 claims
- 0983US10395706B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 27, 2019·5 cites·19 claims
- 1078US11527470B2Film package and method of fabricating package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·1 cites·19 claims
- 1177US10410722B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·2 cites·20 claims
- 1276US10971548B2Variable resistance memory device including symmetrical memory cell arrangements and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·32 claims
- 1374US9401401B2Semiconductor deviceMAGNACHIP SEMICONDUCTOR LTD·Filed 2014·Granted Jul 26, 2016·4 cites·22 claims
- 1472US10043789B2Semiconductor packages including an adhesive patternKIM YOUNGBAE·Filed 2017·Granted Aug 7, 2018·2 cites·20 claims
- 1571US10699056B1Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 1671US9500890B2Method of manufacturing device substrate and display device manufactured using the sameSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Nov 22, 2016·3 cites·26 claims
- 1770US9552879B2Nonvolatile memory device having variable resistance memory cells and a method of resetting by initially performing pre-read or strong set operationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 24, 2017·4 cites·19 claims
- 1870US9514807B2Variable resistance memory deviceKANG YOUNSEON·Filed 2015·Granted Dec 6, 2016·5 cites·20 claims
- 1966US8778477B2Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation memberHWANG MINKYU·Filed 2010·Granted Jul 15, 2014·3 cites·12 claims
- 2063US2025210576A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2163US2025372566A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2263US2025210502A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2362US2025149481A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2461US2025318161A1High voltage semiconductor device including bootstrap schottky diodeSK KEYFOUNDRY INC·Filed 2024·Application pending·0 cites
- 2561US2025087541A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2661US2025105232A1Photonic ic chip, optical device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2761US2025311398A1High voltage semiconductor device including bootstrap schottky diodeSK KEYFOUNDRY INC·Filed 2024·Application pending·0 cites
- 2860US2025140752A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2959US2024421093A1Wiring substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3059US2025046692A1Wiring substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3159US2024421080A1High bandwidth memory structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3259US2025029927A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3359US2025006648A1Wiring substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3459US2024421136A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3559US2025022824A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3658US2024395650A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3757US2024079300A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3857US2025029913A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3956US12119288B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·9 claims
- 4056US10720211B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·20 claims
- 4154US2025295032A1Composition for organic electroluminescent device and organic electroluminescent device comprising sameSOLUS ADVANCED MATERIALS CO LTD·Filed 2023·Application pending·0 cites
- 4253US11140772B2Printed circuit board including warpage offset regions and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 4353US2025366302A1Pellet for organic electroluminescent device and organic electroluminescent device using sameSOLUS ADVANCED MATERIALS CO LTD·Filed 2023·Application pending·0 cites
- 4452US2025359425A1Composition for organic electroluminescent element and organic electroluminescent element comprising sameSOLUS ADVANCED MATERIALS CO LTD·Filed 2023·Application pending·0 cites
- 4552US2025311625A1Organic light-emitting compound, and organic electroluminescent element comprising sameSOLUS ADVANCED MATERIALS CO LTD·Filed 2023·Application pending·0 cites
- 4651US10506706B2Printed circuit board including warpage offset regions and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 4751US2024071845A1Semiconductor package and package-on-package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4851US2024071895A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4949US10580469B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 5048US2014231708A1Reactive cell opener composition, polyol composition, and open-celled polyurethane foamLG ELECTRONICS INC·Filed 2014·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →