Inventor · disambiguated record
Young-Ja Kim
Also filed as: KIM YOUNG · KIM YOUNG-JA
11 granted patents·6 pending applications·10 citations·filing 2011–2024
82Inventor score
Top patents by PatentIndex Score
17 records- 0178US10765717B2Detoxifying composition containing new green extract as active ingredientFAMENITY CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·10 claims
- 0278US9818699B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 14, 2017·3 cites·19 claims
- 0376US9748193B2Printed circuit board and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 29, 2017·3 cites·33 claims
- 0465US8757134B2Wafer dicing blade and wafer dicing apparatus including the sameKIM YOUNG-JA·Filed 2011·Granted Jun 24, 2014·3 cites·19 claims
- 0561US2025149456A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025038156A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2017333506A1Detoxifying composition containing new green extract as active ingredientFAMENITY CO LTD·Filed 2015·Application pending·0 cites
- 0857US12469749B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 0957US8749044B2Semiconductor memory modules and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 10, 2014·1 cites·14 claims
- 1056US2024321622A1Adsorption device for reflow process and method of attaching connection bump using the same, and vacuum jig for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US12438009B2Apparatus for mounting solder ballsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·17 claims
- 1252US12051680B2Semiconductor package aligning interposer and substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·18 claims
- 1349US8866295B2Semiconductor memory modules and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 21, 2014·0 cites·4 claims
- 1441US2013223001A1Printed circuit board and memory module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1540US10702874B2Apparatus for recycling waste raw materialCERAM CO LTD·Filed 2014·Granted Jul 7, 2020·0 cites·18 claims
- 1640US8956923B2Methods of fabricating semiconductor devices and underfill equipment for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·0 cites·12 claims
- 1736US2016273010A1Melt compounding and fractionation of lignocellulosic biomass and products produced therefromRENNECKAR SCOTT·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →