Inventor · disambiguated record
Youngsuk Kim
Also filed as: KIM YOUNGSUK
58 granted patents·16 pending applications·243 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
74 records- 0199US12288682B2Processing method of waferDISCO CORP·Filed 2022·Granted Apr 29, 2025·8 cites·15 claims
- 0298US9828715B2Laundry maching having a drying functionLG ELECTRONICS INC·Filed 2016·Granted Nov 28, 2017·17 cites·19 claims
- 0398US9194073B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Nov 24, 2015·23 cites·27 claims
- 0498US8800165B2Laundry machine having a drying functionKWON IG GEUN·Filed 2010·Granted Aug 12, 2014·35 cites·32 claims
- 0596US9163352B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Oct 20, 2015·17 cites·13 claims
- 0696US9027256B2Laundry lint filter cleaning machineKIM YOUNGSUK·Filed 2013·Granted May 12, 2015·42 cites·11 claims
- 0796US8997377B2Clothes treatment apparatus and method for controlling a clothes treatment apparatusLG ELECTRONICS INC·Filed 2012·Granted Apr 7, 2015·26 cites·17 claims
- 0894US9683325B2Clothes treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Jun 20, 2017·8 cites·20 claims
- 0994US9200837B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Dec 1, 2015·9 cites·22 claims
- 1093US9677215B2Laundry treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Jun 13, 2017·7 cites·16 claims
- 1193US9255353B2Laundry machine having a drying functionKWON IG GEUN·Filed 2014·Granted Feb 9, 2016·9 cites·19 claims
- 1292US9279211B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Mar 8, 2016·10 cites·20 claims
- 1391US9290885B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Mar 22, 2016·8 cites·20 claims
- 1491US9200838B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Dec 1, 2015·6 cites·24 claims
- 1587US11164802B2Wafer manufacturing method and multilayer device chip manufacturing methodDISCO CORP·Filed 2020·Granted Nov 2, 2021·2 cites·7 claims
- 1681US11935863B2Laser reflow apparatus and laser reflow methodDISCO CORP·Filed 2020·Granted Mar 19, 2024·1 cites·19 claims
- 1780US10937668B2Semiconductor package manufacturing methodDISCO CORP·Filed 2019·Granted Mar 2, 2021·3 cites·9 claims
- 1877US10403520B2Multi-blade and processing method of workpieceDISCO CORP·Filed 2018·Granted Sep 3, 2019·3 cites·3 claims
- 1977US9803306B2Clothes treatment apparatus and a method for controlling a clothes treatment apparatusLG ELECTRONICS INC·Filed 2012·Granted Oct 31, 2017·3 cites·14 claims
- 2076US2024402432A1Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2024·Application pending·0 cites
- 2174US11576314B2Plant cultivating apparatusLG ELECTRONICS INC·Filed 2019·Granted Feb 14, 2023·1 cites·20 claims
- 2271US10707176B2Method of manufacturing semiconductor packageDISCO CORP·Filed 2018·Granted Jul 7, 2020·1 cites·6 claims
- 2371US9909249B2Laundry treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Mar 6, 2018·1 cites·9 claims
- 2470US10700014B2Method of manufacturing semiconductor packageDISCO CORP·Filed 2017·Granted Jun 30, 2020·1 cites·14 claims
- 2567US11183464B2Package substrate processing method and protective tapeDISCO CORP·Filed 2018·Granted Nov 23, 2021·1 cites·14 claims
- 2666US10211164B2Semiconductor package manufacturing methodDISCO CORP·Filed 2017·Granted Feb 19, 2019·1 cites·3 claims
- 2766US2023090909A1Processing method and processing apparatus for workpieceDISCO CORP·Filed 2022·Application pending·0 cites
- 2861US12104057B2Curable composition and optical material comprising cured product thereofLG CHEMICAL LTD·Filed 2020·Granted Oct 1, 2024·0 cites·16 claims
- 2959US2021294041A1Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2020·Application pending·0 cites
- 3059US2022192115A1Plant cultivation apparatusLG ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 3159US2024071827A1Dividing method of waferDISCO CORP·Filed 2023·Application pending·0 cites
- 3258US12441843B2Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2020·Granted Oct 14, 2025·0 cites·9 claims
- 3358US11590629B2Method of processing workpiece and resin sheet unitDISCO CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 3458US11528858B2Plant cultivating apparatusLG ELECTRONICS INC·Filed 2019·Granted Dec 20, 2022·0 cites·17 claims
- 3558US2023178734A1Negative Electrode for Secondary Battery, Method of Manufacturing the Same, and Lithium Secondary Battery Including the SameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 3657US12474217B2Inspection methodDISCO CORP·Filed 2023·Granted Nov 18, 2025·0 cites·4 claims
- 3757US2023298938A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 3857US2023249283A1Processing systemDISCO CORP·Filed 2023·Application pending·0 cites
- 3956US2022192106A1Plant cultivation apparatusLG ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 4055US11764115B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 4154US12300545B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 4254US11854891B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 4354US11764114B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 4454US11756831B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 4553US12317653B2Method of manufacturing LED display panelDISCO CORP·Filed 2022·Granted May 27, 2025·0 cites·2 claims
- 4653US12065544B2Curable composition and optical element comprising cured product thereofLG CHEMICAL LTD·Filed 2019·Granted Aug 20, 2024·0 cites·8 claims
- 4753US11607771B2Wafer processing apparatusDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·14 claims
- 4852US12198990B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 4950US11133198B2Method of manufacturing packaged device chipDISCO CORP·Filed 2020·Granted Sep 28, 2021·0 cites·6 claims
- 5050US10586699B2Method of assessing semiconductor substrate and method of assessing device chipDISCO CORP·Filed 2018·Granted Mar 10, 2020·0 cites·7 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →