Inventor · disambiguated record
Yoshie Kimura
Also filed as: KIMURA YOSHIE
19 granted patents·8 pending applications·119 citations·filing 2011–2025
93Inventor score
Top patents by PatentIndex Score
27 records- 0196US11211253B2Atomic layer deposition and etch in a single plasma chamber for critical dimension controlLAM RES CORP·Filed 2020·Granted Dec 28, 2021·8 cites·18 claims
- 0295US9515156B2Air gap spacer integration for improved fin device performanceLAM RES CORP·Filed 2015·Granted Dec 6, 2016·42 cites·19 claims
- 0392US10734238B2Atomic layer deposition and etch in a single plasma chamber for critical dimension controlLAM RES CORP·Filed 2017·Granted Aug 4, 2020·10 cites·18 claims
- 0492US8852964B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2013·Granted Oct 7, 2014·14 cites·18 claims
- 0591US9230819B2Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processingLAM RES CORP·Filed 2014·Granted Jan 5, 2016·15 cites·30 claims
- 0690US9633846B2Internal plasma grid applications for semiconductor fabricationLAM RES CORP·Filed 2015·Granted Apr 25, 2017·8 cites·23 claims
- 0788US12125711B2Reducing roughness of extreme ultraviolet lithography resistsLAM RES CORP·Filed 2020·Granted Oct 22, 2024·3 cites·20 claims
- 0881US10957561B2Gas delivery systemLAM RES CORP·Filed 2015·Granted Mar 23, 2021·5 cites·55 claims
- 0981US9012243B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2014·Granted Apr 21, 2015·4 cites·15 claims
- 1080US10515815B2Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formationLAM RES CORP·Filed 2017·Granted Dec 24, 2019·4 cites·17 claims
- 1178US10950454B2Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP methodLAM RES CORP·Filed 2017·Granted Mar 16, 2021·2 cites·16 claims
- 1278US10658174B2Atomic layer deposition and etch for reducing roughnessLAM RES CORP·Filed 2017·Granted May 19, 2020·3 cites·12 claims
- 1369US12046450B2Synchronization of RF generatorsLAM RES CORP·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1461US2021287909A1Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp methodLAM RES CORP·Filed 2021·Application pending·0 cites
- 1561US2025149330A1Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2025·Application pending·0 cites
- 1660US11170997B2Atomic layer deposition and etch for reducing roughnessLAM RES CORP·Filed 2020·Granted Nov 9, 2021·0 cites·14 claims
- 1759US12217955B2Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
- 1859US8431461B1Silicon nitride dry trim without top pulldownZHONG QINGHUA·Filed 2011·Granted Apr 30, 2013·1 cites·19 claims
- 1958US2024428438A1Computer-readable recording medium storing information processing program, information processing method, and information processing deviceFUJITSU LTD·Filed 2024·Application pending·0 cites
- 2056US12367664B2Computer-readable recording medium storing label change program, label change method, and information processing apparatusFUJITSU LTD·Filed 2022·Granted Jul 22, 2025·0 cites·7 claims
- 2154US2023206694A1Non-transitory computer-readable recording medium, information processing method, and information processing apparatusFUJITSU LTD·Filed 2022·Application pending·0 cites
- 2251US2024379375A1Method and apparatus for etching a carbon containing layerLAM RES CORP·Filed 2022·Application pending·0 cites
- 2351US2023206641A1Storage medium, information processing method, and information processing apparatusFUJITSU LTD·Filed 2022·Application pending·0 cites
- 2450US11428522B2Distance measuring device, distance measuring method, and non-transitory computer-readable storage medium for storing programFUJITSU LTD·Filed 2018·Granted Aug 30, 2022·0 cites·18 claims
- 2544US9589853B2Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamberLAM RES CORP·Filed 2014·Granted Mar 7, 2017·0 cites·20 claims
- 2638US2014179106A1In-situ metal residue cleanLAM RES CORP·Filed 2012·Application pending·0 cites
- 2736US2014051256A1Etch with mixed mode pulsingZHONG QINGHUA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →