Inventor · disambiguated record
Youn Sung Ko
Also filed as: KO YOUN-SUNG
9 granted patents·9 pending applications·20 citations·filing 2004–2025
81Inventor score
Top patents by PatentIndex Score
18 records- 0183US7624498B2Apparatus for detaching a semiconductor chip from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·10 cites·18 claims
- 0280US12237296B2System for laser bonding of flip chipPROTEC CO LTD·Filed 2021·Granted Feb 25, 2025·1 cites·15 claims
- 0377US7650687B2Die attaching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·7 cites·14 claims
- 0467US2025269451A1Head assembly for mounting conductive ballPROTEC CO LTD·Filed 2025·Application pending·0 cites
- 0565US12325088B2Head assembly for mounting conductive ballPROTEC CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·16 claims
- 0664US10804239B2Apparatus for mounting conductive ballPROTEC CO LTD·Filed 2019·Granted Oct 13, 2020·1 cites·13 claims
- 0757US12217995B2Method of mounting conductive balls using electrostatic chuckPROTEC CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·14 claims
- 0854US2024178182A1Apparatus and method for flip chip laser bondingPROTEC CO LTD·Filed 2023·Application pending·0 cites
- 0953US2025136428A1Coupler supporting module for drum containerPROTEC CO LTD·Filed 2024·Application pending·0 cites
- 1053US2010037445A1Method of and apparatus for detaching semiconductor chips from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1151US11810890B2Flip-chip bonding apparatus using VCSEL devicePROTEC CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 1243US2025226237A1Method for mounting bonding material depositsPROTEC CO LTD·Filed 2025·Application pending·0 cites
- 1341US7481351B2Wire bonding apparatus and method for clamping a wireSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 27, 2009·1 cites·23 claims
- 1440US10804240B2Method of mounting conductive ballPROTEC CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·13 claims
- 1540US2007277128A1System and method for sensing shape of chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1636US2008090311A1Dipping detecting device for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1734US2006266792A1Multi-chip die bonder and methodKO YOUN-SUNG·Filed 2005·Application pending·0 cites
- 1829US2015279716A1Apparatus and method for detaching chipPROTEC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →