Inventor · disambiguated record
Yong-Sun Ko
Also filed as: KO YONG-RIM · KO YONG-SUN
62 granted patents·38 pending applications·446 citations·filing 1996–2023
98Inventor score
Top patents by PatentIndex Score
100 records- 0193US7271100B2Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 18, 2007·18 cites·8 claims
- 0292US10418366B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 17, 2019·7 cites·14 claims
- 0391US7445997B2Methods of forming non-volatile memory devices having floating gate electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 4, 2008·10 cites·34 claims
- 0489US10916549B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·4 cites·20 claims
- 0589US10029332B2Spot heater and device for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 24, 2018·6 cites·16 claims
- 0689US6638855B1Method of filling contact hole of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 28, 2003·73 cites·13 claims
- 0788US7156722B2Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 2, 2007·13 cites·20 claims
- 0885US11664243B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 30, 2023·4 cites·10 claims
- 0985US7151043B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·14 cites·20 claims
- 1084US7534726B2Method of forming a recess channel trench pattern, and fabricating a recess channel transistorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·8 cites·6 claims
- 1183US10985036B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 20, 2021·3 cites·17 claims
- 1283US6889447B2Method for drying a wafer and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 10, 2005·29 cites·20 claims
- 1381US6399552B1Aqueous cleaning solution for removing contaminants surface of circuit substrate cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 4, 2002·40 cites·13 claims
- 1479US10576582B2Spot heater and device for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·2 cites·12 claims
- 1579US6802911B2Method for cleaning damaged layers and polymer residue from semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 12, 2004·22 cites·40 claims
- 1676US7713879B2Chemical mechanical polishing methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 11, 2010·2 cites·24 claims
- 1775US7667221B2Phase change memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·11 cites·20 claims
- 1875US6331478B1Methods for manufacturing semiconductor devices having chamfered metal silicide layersSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Dec 18, 2001·25 cites·17 claims
- 1974US10438891B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 8, 2019·2 cites·17 claims
- 2073US6369008B1Cleaning solutions for removing contaminants from the surfaces of semiconductor substrates and cleaning methods using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 9, 2002·17 cites·14 claims
- 2171US10910237B2Operating method for wet etching system and related systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 2271US7452773B2Method of manufacturing a flash memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·5 cites·20 claims
- 2370US10438799B2Methods of fabricating semiconductor devices including support patternsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 8, 2019·1 cites·14 claims
- 2470US8592315B2Chemical mechanical polishing methodKIM DONG-KEUN·Filed 2010·Granted Nov 26, 2013·2 cites·8 claims
- 2570US7534704B2Thin layer structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 19, 2009·5 cites·17 claims
- 2669US7589013B2Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 15, 2009·4 cites·7 claims
- 2769US6875706B2Cleaning solution and method of cleaning a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·10 cites·15 claims
- 2868US11329053B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 10, 2022·0 cites·20 claims
- 2968US8053751B2Phase-change semiconductor device and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·3 cites·4 claims
- 3068US7205199B2Method of forming a recess channel trench pattern, and fabricating a recess channel transistorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 17, 2007·10 cites·10 claims
- 3167US5855077AApparatus for drying semiconductor wafers using isopropyl alcoholSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jan 5, 1999·35 cites·12 claims
- 3265US8048809B2Polishing method using chemical mechanical slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 1, 2011·1 cites·21 claims
- 3365US7781346B2Methods of forming patterns and capacitors for semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 24, 2010·2 cites·10 claims
- 3465US2007210334A1Phase change memory device and method of fabricating the sameLIM YOUNG-SOO·Filed 2007·Application pending·0 cites
- 3564US7745341B2Phase-change semiconductor device and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 29, 2010·2 cites·14 claims
- 3664US7709319B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 4, 2010·2 cites·17 claims
- 3763US11361960B2Substrate processing apparatus and substrate processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 3862US11887868B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·17 claims
- 3960US7091117B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 15, 2006·5 cites·17 claims
- 4059US12412767B2Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 4159US7659162B2Phase change memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 9, 2010·1 cites·14 claims
- 4256US8084801B2Cell structure for a semiconductor memory device and method of fabricating the sameBAEK KYOUNG-YUN·Filed 2009·Granted Dec 27, 2011·2 cites·8 claims
- 4356US6831012B2Method for forming a silicide film of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 14, 2004·5 cites·20 claims
- 4455US2008042100A1Slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4554US10795263B2Compositions for removing photoresistSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·7 claims
- 4654US10707071B2Substrate processing apparatus and substrate processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 7, 2020·0 cites·19 claims
- 4753US12272543B2Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·7 claims
- 4853US6838330B2Method of forming a contact hole of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 4, 2005·9 cites·13 claims
- 4953US2024145263A1Substrate treating apparatusSEMES CO LTD·Filed 2023·Application pending·0 cites
- 5052US2018197861A1Semiconductor devices including varied depth recesses for contactsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →