Inventor · disambiguated record
Yoshihiro Kodaira
Also filed as: KODAIRA YOSHIHIRO
20 granted patents·5 pending applications·89 citations·filing 1997–2025
92Inventor score
Files withFUJI ELECTRIC CO LTD19KODAIRA YOSHIHIRO3OLYMPUS OPTICAL CO1ONISHI KAZUNAGA1TAKAMIYA YOSHIKAZU1
Top patents by PatentIndex Score
25 records- 0193US10777473B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Sep 15, 2020·11 cites·13 claims
- 0283US10297533B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted May 21, 2019·4 cites·10 claims
- 0383US8933554B2Semiconductor device and method for manufacturing semiconductor deviceKODAIRA YOSHIHIRO·Filed 2012·Granted Jan 13, 2015·8 cites·5 claims
- 0476US9078355B2Semiconductor deviceKODAIRA YOSHIHIRO·Filed 2012·Granted Jul 7, 2015·3 cites·6 claims
- 0574US12296409B2Solder materialFUJI ELECTRIC CO LTD·Filed 2023·Granted May 13, 2025·0 cites·4 claims
- 0672US9831152B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·5 claims
- 0771US10070527B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·14 claims
- 0870US9691674B2Semiconductor device and method for manufacturing sameFUJI ELECTRIC CO LTD·Filed 2015·Granted Jun 27, 2017·2 cites·13 claims
- 0969US10504868B2Solder joiningFUJI ELECTRIC CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 1068US9171768B2Semiconductor deviceTAKAMIYA YOSHIKAZU·Filed 2012·Granted Oct 27, 2015·4 cites·4 claims
- 1166US9941254B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Apr 10, 2018·1 cites·6 claims
- 1265US9167699B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Oct 20, 2015·2 cites·12 claims
- 1364US8941228B2Semiconductor module and manufacturing method thereofKODAIRA YOSHIHIRO·Filed 2011·Granted Jan 27, 2015·2 cites·7 claims
- 1462US5902244AUltrasonic diagnosis apparatus including simple digital scan converterOLYMPUS OPTICAL CO·Filed 1997·Granted May 11, 1999·47 cites·13 claims
- 1562US2024431041A1Semiconductor module, semiconductor device, and vehicleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1662US2024404912A1Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1758US11850685B2Solder materialFUJI ELECTRIC CO LTD·Filed 2019·Granted Dec 26, 2023·0 cites·5 claims
- 1852US9136225B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Sep 15, 2015·0 cites·5 claims
- 1951US11107787B2Member for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 31, 2021·0 cites·9 claims
- 2051US10153246B2Method for producing member for semiconductor device and semiconductor device, and member for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Dec 11, 2018·0 cites·16 claims
- 2151US2023345637A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 2250US2025279339A1Semiconductor device and external connection main terminalFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2345US10522434B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·12 claims
- 2445US2025309072A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2535US8664765B2Semiconductor deviceONISHI KAZUNAGA·Filed 2011·Granted Mar 4, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →