Inventor · disambiguated record
Yoshio Kohno
Also filed as: KOHNO YOSHIO
12 granted patents·145 citations·filing 1976–1997
91Inventor score
Top patents by PatentIndex Score
12 records- 0187US4044540AElastomer coated carbon filament reinforcing yarn or cord, method and articleTORAY INDUSTRIES·Filed 1976·Granted Aug 30, 1977·34 cites·13 claims
- 0282US4367316AVulcanized elastomeric molded articleTORAY INDUSTRIES·Filed 1978·Granted Jan 4, 1983·26 cites·9 claims
- 0369US4290927AVulcanizable polyblendTORAY INDUSTRIES·Filed 1980·Granted Sep 22, 1981·17 cites·13 claims
- 0461US5384731ASRAM memory structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 24, 1995·20 cites·16 claims
- 0548US5093706ASemiconductor device having multiple layer resistance layer structure and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 3, 1992·14 cites·18 claims
- 0647US5379247ASemiconductor memory device including memory cells connected to a ground lineMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jan 3, 1995·9 cites·18 claims
- 0745US5463576ASemiconductor memory device including memory cells connected to a ground lineMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 31, 1995·8 cites·4 claims
- 0840USRE36531ESemiconductor memory device including memory cells connected to a ground lineMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jan 25, 2000·4 cites·19 claims
- 0940US5859444ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 12, 1999·9 cites·14 claims
- 1033US4984199ASemiconductor memory cells having common contact holeMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 8, 1991·3 cites·10 claims
- 1129US4887137ASemiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Dec 12, 1989·1 cites·8 claims
- 1226US5550390ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Aug 27, 1996·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →