Inventor · disambiguated record
Yosuke Koma
Also filed as: KOMA YOSUKE
2 granted patents·5 pending applications·0 citations·filing 2015–2023
23Inventor score
Files withLINTEC CORP7
Top patents by PatentIndex Score
7 records- 0156US10450485B2Pressure sensitive adhesive sheetLINTEC CORP·Filed 2016·Granted Oct 22, 2019·0 cites·19 claims
- 0248US2024424271A1Microneedle patchLINTEC CORP·Filed 2022·Application pending·0 cites
- 0347US2025339659A1Microneedle structure and method for producing microneedle structureLINTEC CORP·Filed 2023·Application pending·0 cites
- 0446US2024001625A1Projection-bearing body manufacturing method and projection-bearing body manufacturing deviceLINTEC CORP·Filed 2023·Application pending·0 cites
- 0542US2024044369A1Projection-bearing body manufacturing method and projection-bearing body manufacturing deviceLINTEC CORP·Filed 2023·Application pending·0 cites
- 0638US2024180465A1Microneedle structure and method for producing sameLINTEC CORP·Filed 2022·Application pending·0 cites
- 0725US9905451B2Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheetLINTEC CORP·Filed 2015·Granted Feb 27, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →