Inventor · disambiguated record
Young Mo Lee
Also filed as: LEE YOUNG MO
7 granted patents·2 pending applications·9 citations·filing 2001–2024
74Inventor score
Files withNEPES CO LTD3SK HYNIX INC2HYNIX SEMICONDUCTOR INC1HYUNDAI ELECTRONICS IND1JINWOO BIO CO LTD1
Top patents by PatentIndex Score
9 records- 0168US11276632B2Semiconductor packageNEPES CO LTD·Filed 2019·Granted Mar 15, 2022·2 cites·17 claims
- 0265US10435520B2Polymer-hybrid carbon filler composite and method for preparing the sameKOREA INST SCI & TECH·Filed 2017·Granted Oct 8, 2019·0 cites·10 claims
- 0359US2024347434A1Package for semiconductorNEPES CO LTD·Filed 2024·Application pending·0 cites
- 0452US11298855B2Method for manufacturing hyaluronate film, and hyaluronate film manufactured therebyJINWOO BIO CO LTD·Filed 2018·Granted Apr 12, 2022·0 cites·2 claims
- 0551US6432766B1Method of fabricating a SRAM deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Aug 13, 2002·5 cites·7 claims
- 0651US2022352059A1Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2022·Application pending·0 cites
- 0750US9335625B2Blank masks for extreme ultra violet lithography, methods of fabricating the same, and methods of correcting registration errors thereofSK HYNIX INC·Filed 2014·Granted May 10, 2016·0 cites·8 claims
- 0848US8906582B2Blank masks for extreme ultra violet lithography, methods of fabricating the same, and methods of correcting registration errors thereofSK HYNIX INC·Filed 2012·Granted Dec 9, 2014·0 cites·5 claims
- 0946US6764944B2Method for forming metal wire interconnection in semiconductor devices using dual damascene processHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jul 20, 2004·2 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →