Inventor · disambiguated record
Yongin Lee
Also filed as: LEE YONGIN
5 granted patents·3 pending applications·2 citations·filing 2017–2024
64Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0184US11543871B2Storage device, multi-component device and method of controlling operation of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·2 cites·20 claims
- 0264US11971764B2Storage device, multi-component device and method of controlling operation of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·19 claims
- 0362US11868626B2Storage device set including storage device and reconfigurable logic chip, and storage system including the storage device setSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0454US11474714B2Storage device set including storage device and reconfigurable logic chip, and storage system including the storage device setSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·19 claims
- 0549US2024242981A1Substrate bonding apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0646US2024234215A9Apparatus for measuring an adhesion forceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0745US2024038536A1Plasma processing apparatus, wafer to wafer bonding system and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0831US10784130B2Bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Yongin Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →