Inventor · disambiguated record
Young-Sam Lim
Also filed as: LIM YOUNG-SAM
11 granted patents·7 pending applications·42 citations·filing 2002–2012
88Inventor score
Top patents by PatentIndex Score
18 records- 0183US7442111B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 28, 2008·8 cites·18 claims
- 0278US8110508B2Method of forming a bump structure using an etching composition for an under bump metallurgy layerKANG DONG-MIN·Filed 2008·Granted Feb 7, 2012·5 cites·11 claims
- 0374US7229337B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·14 cites·11 claims
- 0472US8293613B2Gettering structures and methods and their applicationPARK YOUNG-SOO·Filed 2010·Granted Oct 23, 2012·2 cites·14 claims
- 0572US7815496B2Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 19, 2010·4 cites·21 claims
- 0671US8395270B2Etching composition for an under-bump metallurgy layerKANG DONG-MIN·Filed 2012·Granted Mar 12, 2013·1 cites·8 claims
- 0766US7662022B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 16, 2010·2 cites·10 claims
- 0853US2008224269A1Gettering structures and methods and their applicationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0950US7858527B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 28, 2010·0 cites·14 claims
- 1050US7491118B2Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigiditySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 17, 2009·1 cites·4 claims
- 1147US7090570B2Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigiditySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 15, 2006·4 cites·1 claims
- 1246US2008213982A1Method of fabricating semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1345US7288212B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 30, 2007·1 cites·8 claims
- 1444US2010203729A1Composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1541US2006216942A1Wafer carrier for minimizing contacting area with wafersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1638US2007287280A1Composition for removing a photoresist and method of forming a bump electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1736US2008045035A1Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solutionLEE JI-SUNG·Filed 2007·Application pending·0 cites
- 1834US2004023491A1Preparation and use of an abrasive slurry compositionFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →