Inventor · disambiguated record
You-Wei Lin
Also filed as: LIN YOU-WEI
8 granted patents·3 pending applications·6 citations·filing 2016–2022
76Inventor score
Files withMEDIATEK INC4MSTAR SEMICONDUCTOR INC4AUTOMOTIVE RES & TESTING CT1RAYNERGY TEK INC1UNION APPLIED GENE INC1
Top patents by PatentIndex Score
11 records- 0186US11562948B2Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor packageMEDIATEK INC·Filed 2020·Granted Jan 24, 2023·2 cites·10 claims
- 0274US9640475B1Chip packaging structure and manufacturing method thereofMSTAR SEMICONDUCTOR INC·Filed 2016·Granted May 2, 2017·3 cites·24 claims
- 0367US12205869B2Method for forming a semiconductor packageMEDIATEK INC·Filed 2022·Granted Jan 21, 2025·0 cites·6 claims
- 0467US10559513B2Circuit board and packaged chipMSTAR SEMICONDUCTOR INC·Filed 2017·Granted Feb 11, 2020·1 cites·10 claims
- 0557US11296006B2Circuit board and packaged chipMEDIATEK INC·Filed 2019·Granted Apr 5, 2022·0 cites·14 claims
- 0654US12230598B2Semiconductor packageMEDIATEK INC·Filed 2022·Granted Feb 18, 2025·0 cites·14 claims
- 0750US10622314B2Chip package structureMSTAR SEMICONDUCTOR INC·Filed 2018·Granted Apr 14, 2020·0 cites·12 claims
- 0843US11737351B2Organic semiconductor material and organic photoelectric device using the sameRAYNERGY TEK INC·Filed 2020·Granted Aug 22, 2023·0 cites·7 claims
- 0939US2019180623A1Collision prediction method and deviceAUTOMOTIVE RES & TESTING CT·Filed 2017·Application pending·0 cites
- 1035US2017357770A1Health risk cloud analysis system capable of integrating gene information and acquired lifestyleUNION APPLIED GENE INC·Filed 2016·Application pending·0 cites
- 1135US2019067208A1Circuit board and chip packageMSTAR SEMICONDUCTOR INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →