Inventor · disambiguated record
Yoji Nagano
Also filed as: NAGANO YOJI
13 granted patents·3 pending applications·109 citations·filing 1991–2013
91Inventor score
Files withSEMICONDUCTOR ENERGY LAB6NAGANO YOJI2OGASHIWA TOSHINORI2TOSHIBA CERAMICS CO2EPSON TOYOCOM CORP1
Top patents by PatentIndex Score
16 records- 0190US7820524B2Manufacturing method of SOI substrate and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Oct 26, 2010·18 cites·28 claims
- 0288US8941017B2Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatusNAGANO YOJI·Filed 2011·Granted Jan 27, 2015·14 cites·5 claims
- 0388US7897476B2Method of manufacturing SOI substrateSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Mar 1, 2011·12 cites·16 claims
- 0478US8895407B2Manufacturing method of SOI substrate and manufacturing method of semiconductor deviceMIYAIRI HIDEKAZU·Filed 2010·Granted Nov 25, 2014·4 cites·8 claims
- 0578US8505804B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2008·Granted Aug 13, 2013·8 cites·3 claims
- 0677US8069549B2Method for sealing a quartz crystal deviceNAGANO YOJI·Filed 2008·Granted Dec 6, 2011·9 cites·7 claims
- 0771US8193068B2Method of manufacturing SOI substrateYAMAZAKI SHUNPEI·Filed 2011·Granted Jun 5, 2012·2 cites·18 claims
- 0866US7928635B2Package for electronic component and piezoelectric resonatorEPSON TOYOCOM CORP·Filed 2009·Granted Apr 19, 2011·5 cites·7 claims
- 0964US5298328APacking material and method of making sameTOSHIBA CERAMICS CO·Filed 1991·Granted Mar 29, 1994·33 cites·5 claims
- 1053US9362522B2Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting deviceSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Jun 7, 2016·0 cites·8 claims
- 1149US8558433B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2012·Granted Oct 15, 2013·0 cites·4 claims
- 1248US8344599B2Quartz crystal device and method for sealing the sameSEIKO EPSON CORP·Filed 2011·Granted Jan 1, 2013·0 cites·4 claims
- 1347US2010173472A1Method for manufacturing soi substrate and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2009·Application pending·0 cites
- 1446US2009115028A1Method for manufacturing semiconductor substrate, semiconductor device and electronic deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Application pending·0 cites
- 1546US2009072343A1Semiconductor device and electronic applianceSEMICONDUCTOR ENERGY LAB·Filed 2008·Application pending·0 cites
- 1641US5304241AElectronic component sealing fillerTOSHIBA CERAMICS CO·Filed 1992·Granted Apr 19, 1994·4 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →