Inventor · disambiguated record
Yoshiyuki Nagatomo
Also filed as: NAGATOMO YOSHIYUKI
68 granted patents·17 pending applications·385 citations·filing 1999–2022
98Inventor score
Files withMITSUBISHI MATERIALS CORP78KUROMITSU YOSHIROU2NAGATOMO YOSHIYUKI2KITAHARA TAKESHI1NAGASE TOSHIYUKI1
Top patents by PatentIndex Score
85 records- 0192US9066433B2Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2012·Granted Jun 23, 2015·6 cites·16 claims
- 0291US6310775B1Power module substrateMITSUBISHI MATERIALS CORP·Filed 2000·Granted Oct 30, 2001·82 cites·6 claims
- 0390US10173282B2Bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jan 8, 2019·4 cites·20 claims
- 0490US9905437B2Method of producing bonded body and method of producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 27, 2018·4 cites·19 claims
- 0590US7532481B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialMITSUBISHI MATERIALS CORP·Filed 2005·Granted May 12, 2009·17 cites·6 claims
- 0689US9786577B2Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Oct 10, 2017·7 cites·3 claims
- 0787US11393738B2Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Jul 19, 2022·5 cites·5 claims
- 0886US9480144B2Power module substrate, power module substrate with heat sink, and power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Oct 25, 2016·8 cites·8 claims
- 0986US6563709B2Liquid-cooled heat sink and manufacturing method thereofMITSUBISHI MATERIALS CORP·Filed 2001·Granted May 13, 2003·58 cites·9 claims
- 1085US10319664B2Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sinkMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jun 11, 2019·4 cites·13 claims
- 1185US9723707B2Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 1, 2017·7 cites·12 claims
- 1285US9401340B2Semiconductor device and ceramic circuit substrate, and producing method of semiconductor deviceMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 26, 2016·7 cites·3 claims
- 1381US9807865B2Substrate for power modules, substrate with heat sink for power modules, and power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Oct 31, 2017·5 cites·12 claims
- 1480US9693449B2Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal partMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jun 27, 2017·4 cites·14 claims
- 1580US8164909B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialNAGASE TOSHIYUKI·Filed 2010·Granted Apr 24, 2012·6 cites·3 claims
- 1679US10370303B2Process for producing bonded body and process for producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Granted Aug 6, 2019·3 cites·12 claims
- 1778US7128979B2Circuit board, method of producing same, and power moduleMITSUBISHI MATERIALS CORP·Filed 2003·Granted Oct 31, 2006·24 cites·9 claims
- 1877US9833855B2Method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Dec 5, 2017·4 cites·20 claims
- 1977US9504144B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·8 claims
- 2077US8564118B2Power module substrate, power module, and method for manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2009·Granted Oct 22, 2013·5 cites·9 claims
- 2177US7019975B2Power module and power module with heat sinkMITSUBISHI MATERIALS CORP·Filed 2001·Granted Mar 28, 2006·26 cites·9 claims
- 2275US11062974B2Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Jul 13, 2021·2 cites·7 claims
- 2374US10497637B2Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sinkMITSUBISHI MATERIALS CORP·Filed 2016·Granted Dec 3, 2019·2 cites·10 claims
- 2474US10199237B2Method for manufacturing bonded body and method for manufacturing power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 5, 2019·3 cites·23 claims
- 2573US10103035B2Copper-ceramic bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Granted Oct 16, 2018·2 cites·4 claims
- 2673US9941235B2Power module substrate with Ag underlayer and power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Apr 10, 2018·2 cites·16 claims
- 2773US9735085B2Bonded body, power module substrate, power module and method for producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2015·Granted Aug 15, 2017·2 cites·18 claims
- 2873US9414512B2Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power moduleNAGATOMO YOSHIYUKI·Filed 2010·Granted Aug 9, 2016·5 cites·4 claims
- 2973US8921996B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Dec 30, 2014·2 cites·20 claims
- 3071US9953944B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Apr 24, 2018·3 cites·17 claims
- 3170US10016956B2Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jul 10, 2018·2 cites·23 claims
- 3270US9648737B2Bonded body and power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted May 9, 2017·2 cites·5 claims
- 3370US6483185B1Power module substrate, method of producing the same, and semiconductor device including the substrateMITSUBISHI MATERIALS CORP·Filed 1999·Granted Nov 19, 2002·44 cites·9 claims
- 3469US11908768B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2022·Granted Feb 20, 2024·0 cites·1 claims
- 3569US9079264B2Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 14, 2015·2 cites·10 claims
- 3668US9764416B2Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Sep 19, 2017·2 cites·25 claims
- 3767US10504749B2Semiconductor deviceMITSUBISHI MATERIALS CORP·Filed 2017·Granted Dec 10, 2019·1 cites·5 claims
- 3867US9968012B2Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 8, 2018·2 cites·8 claims
- 3967US9355986B2Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layerMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 31, 2016·2 cites·4 claims
- 4067US9237682B2Power module substrate with heat sink, and method for producing power module substrate with heat sinkMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 12, 2016·2 cites·4 claims
- 4166US9426915B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 23, 2016·2 cites·2 claims
- 4265US9642275B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 2, 2017·2 cites·2 claims
- 4364US11478868B2Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 25, 2022·2 cites·11 claims
- 4463US9560755B2Bonding body, power module substrate, and heat-sink-attached power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jan 31, 2017·1 cites·20 claims
- 4563US8116084B2Method for manufacturing power module substrate, power module substrate, and power moduleKITAHARA TAKESHI·Filed 2008·Granted Feb 14, 2012·3 cites·4 claims
- 4663US2022223493A1Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 4761US10011093B2Bonding structure of aluminum member and copper memberMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 3, 2018·1 cites·3 claims
- 4861US9076755B2Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power moduleTONOMURA HIROSHI·Filed 2010·Granted Jul 7, 2015·2 cites·6 claims
- 4958US12199006B2Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2022·Granted Jan 14, 2025·0 cites·4 claims
- 5058US2021068251A1Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →