Inventor · disambiguated record
Yong Loo Neo
Also filed as: NEO YONG LOO
22 granted patents·1 pending application·586 citations·filing 2002–2012
97Inventor score
Technology areasH10W
Top patents by PatentIndex Score
23 records- 0198US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0296US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0393US7820484B2Wafer level packagingMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·20 cites·48 claims
- 0492US7375009B2Method of forming a conductive via through a waferMICRON TECHNOLOGY INC·Filed 2002·Granted May 20, 2008·51 cites·35 claims
- 0592US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 0691US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 0790US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 0887US7274094B2Leadless packaging for image sensor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 25, 2007·39 cites·24 claims
- 0986US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 1085US7579681B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 25, 2009·28 cites·21 claims
- 1184US7884007B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·8 cites·22 claims
- 1284US7368374B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2004·Granted May 6, 2008·24 cites·36 claims
- 1384US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 1482US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 1581US7112471B2Leadless packaging for image sensor devices and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·27 cites·26 claims
- 1679US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 1779US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 1878US8564106B2Wafer level packagingCHUA SWEE KWANG·Filed 2012·Granted Oct 22, 2013·3 cites·20 claims
- 1972US7659134B2Microelectronic imagers and methods for manufacturing such microelectronic imagersAPTINA IMAGING CORP·Filed 2007·Granted Feb 9, 2010·5 cites·20 claims
- 2069US7271027B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 2167US8698295B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Apr 15, 2014·2 cites·20 claims
- 2262US7553697B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·1 cites·16 claims
- 2343US2004229400A1Multichip wafer level system packages and methods of forming sameFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yong Loo Neo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →