Inventor · disambiguated record
Yoshirou Nishinaka
Also filed as: NISHINAKA YOSHIROU
6 granted patents·299 citations·filing 1992–1998
88Inventor score
Top patents by PatentIndex Score
6 records- 0196US5900582ALead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 4, 1999·106 cites·2 claims
- 0293US5535509AMethod of making a lead on chip (LOC) semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 16, 1996·68 cites·6 claims
- 0383US5763829ALeadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframeMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 9, 1998·38 cites·2 claims
- 0473US5372295ASolder material, junctioning method, junction material, and semiconductor deviceRYODEN SEMICONDUCTOR SYST ENG·Filed 1992·Granted Dec 13, 1994·47 cites·23 claims
- 0562US5609287ASolder material, junctioning method, junction material, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Mar 11, 1997·29 cites·19 claims
- 0653US5724726AMethod of making leadframe for lead-on-chip (LOC) semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 10, 1998·11 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →