Inventor · disambiguated record
Young Mook Oh
Also filed as: OH YOUNG-MOOK
21 granted patents·8 pending applications·73 citations·filing 2005–2023
93Inventor score
Top patents by PatentIndex Score
29 records- 0193US11621196B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·2 cites·20 claims
- 0292US10930749B2Semiconductor devices having a gate isolation layer and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 23, 2021·7 cites·20 claims
- 0392US10395990B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 27, 2019·7 cites·20 claims
- 0492US9899416B2Semiconductor device and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 20, 2018·9 cites·20 claims
- 0592US9786764B2Fin-FET semiconductor device with a source/drain contact having varying different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 10, 2017·10 cites·18 claims
- 0689US10224343B2Semiconductor device and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 5, 2019·6 cites·16 claims
- 0788US9865736B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·7 cites·18 claims
- 0886US10840139B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 17, 2020·4 cites·20 claims
- 0983US11037829B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·19 claims
- 1083US10050114B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 14, 2018·5 cites·20 claims
- 1179US12125750B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1279US7875488B2Method of fabricating image sensor having inner lensSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 25, 2011·5 cites·17 claims
- 1377US7855142B2Methods of forming dual-damascene metal interconnect structures using multi-layer hard masksSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 21, 2010·6 cites·18 claims
- 1470USRE50699ESemiconductor devices having a gate isolation layer and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·40 claims
- 1565US8357576B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 22, 2013·3 cites·19 claims
- 1644US11984448B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·0 cites·15 claims
- 1743US10991620B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 27, 2021·0 cites·20 claims
- 1842US11120998B2Etching method and methods of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 14, 2021·0 cites·7 claims
- 1942US11114535B2Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 7, 2021·0 cites·18 claims
- 2042US9985025B1Active pattern structure and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·0 cites·20 claims
- 2140US10032864B2Semiconductor device having field insulation layer between two finsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·16 claims
- 2240US2019348414A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2339US2019074211A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2439US2014103405A1Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2536US2006024971A1Dry etching method using polymer mask selectively formed by CO gasSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 2633US2011312152A1Methods of Fabricating Integrated Circuit Devices Using Selective Etching Techniques that Account for Etching Distance VariationsKIM YOON-HAE·Filed 2010·Application pending·0 cites
- 2732US2013023127A1Method of forming a contact hole and apparatus for performing the sameCHANG CHONG-KWANG·Filed 2012·Application pending·0 cites
- 2825US2011201202A1Method of forming fine patterns of semiconductor deviceCHANG CHONG-KWANG·Filed 2011·Application pending·0 cites
- 2923US2011256700A1Method of fabricating semiconductor deviceCHANG CHONG-KWANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →