Inventor · disambiguated record
Yosuke Omori
Also filed as: Omori yosuke
16 granted patents·9 pending applications·29 citations·filing 2011–2025
88Inventor score
Top patents by PatentIndex Score
25 records- 0194US10985132B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2020·Granted Apr 20, 2021·4 cites·14 claims
- 0293US10438920B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Oct 8, 2019·12 cites·17 claims
- 0391US10438918B2Bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2017·Granted Oct 8, 2019·8 cites·6 claims
- 0490US11715663B2Bonding apparatus, bonding system, bonding method and recording mediumTOKYO ELECTRON LTD·Filed 2021·Granted Aug 1, 2023·2 cites·10 claims
- 0571US10982833B2Vehicle lampICHIKOH INDUSTRIES LTD·Filed 2018·Granted Apr 20, 2021·1 cites·7 claims
- 0667US8434538B2Bonding apparatus and bonding methodAKIYAMA NAOKI·Filed 2011·Granted May 7, 2013·2 cites·4 claims
- 0765US2023014665A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0859US11164842B2Bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 0959US10756046B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2019·Granted Aug 25, 2020·0 cites·17 claims
- 1057US11837574B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2021·Granted Dec 5, 2023·0 cites·8 claims
- 1154US11482431B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 25, 2022·0 cites·11 claims
- 1254US2024105497A1Substrate processing apparatus and holding method of substrateTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1353US2025293065A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1453US2024006207A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1552US11820367B2Turning controller for vehicle, computer-readable medium storing turning control program, and turning control method for vehicleADVICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·6 claims
- 1651US11488929B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Nov 1, 2022·0 cites·9 claims
- 1750US12078494B2Vehicle control deviceADVICS CO LTD·Filed 2020·Granted Sep 3, 2024·0 cites·3 claims
- 1847US2022089149A1Turn assist device for vehicle, turn assist method for vehicle, and computer-readable medium storing turn assist programADVICS CO LTD·Filed 2021·Application pending·0 cites
- 1944US2015017782A1Bonding device and bonding methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 2044US2016001543A1Bonding device, bonding system, and bonding methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 2143US2022169246A1Control device for vehicleADVICS CO LTD·Filed 2020·Application pending·0 cites
- 2243US2022203976A1Travel control device for vehicleADVICS CO LTD·Filed 2020·Application pending·0 cites
- 2341US11735465B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Aug 22, 2023·0 cites·7 claims
- 2435US8421318B2Rotor of rotating electrical machineKUWAHARA TAKESHI·Filed 2011·Granted Apr 16, 2013·0 cites·6 claims
- 2534US9263312B2Joining device and joining position adjustment method using joining deviceNAKAMURA MICHIKAZU·Filed 2012·Granted Feb 16, 2016·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →