Inventor · disambiguated record
Young-Kuk Park
Also filed as: PARK YOUNG KUK
11 granted patents·145 citations·filing 2000–2010
90Inventor score
Top patents by PatentIndex Score
11 records- 0193US8143727B2Adhesive on wire stacked semiconductor packageOH KWANG SEOK·Filed 2010·Granted Mar 27, 2012·16 cites·18 claims
- 0293US7863723B2Adhesive on wire stacked semiconductor packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Jan 4, 2011·21 cites·20 claims
- 0389US6642610B2Wire bonding method and semiconductor package manufactured using the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Nov 4, 2003·51 cites·12 claims
- 0488US7485490B2Method of forming a stacked semiconductor packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·13 cites·19 claims
- 0571US7260360B2Multi-band ZigBee transceiver supporting IEEE 802.15.4 wireless communicationKOREA ELECTRONICS TECHNOLOGY·Filed 2004·Granted Aug 21, 2007·18 cites·25 claims
- 0669US6803254B2Wire bonding method for a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2003·Granted Oct 12, 2004·14 cites·22 claims
- 0768US7580478B2I/Q modulator using current-mixing and direct conversion wireless communication transmitter using the sameKOREA ELECTRONICS TECHNOLOGY·Filed 2005·Granted Aug 25, 2009·5 cites·8 claims
- 0867US7590391B2Digital intermediate frequency transmitter for wireless communicationKOREA ELECTRONICS TECHNOLOGY·Filed 2006·Granted Sep 15, 2009·3 cites·24 claims
- 0959US7796958B2Transmitter and transmitting method thereof in wireless communication systemKOREA ELECTRONICS TECHNOLOGY·Filed 2007·Granted Sep 14, 2010·2 cites·11 claims
- 1044US7783268B2Transmitter and transmitting method thereof in wireless communication systemKOREA ELECTRONICS TECHNOLOGY·Filed 2007·Granted Aug 24, 2010·0 cites·15 claims
- 1140US8191750B2Apparatus for cutting a liquid crystal display panel and method thereofPARK YOUNG-KUK·Filed 2004·Granted Jun 5, 2012·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →