Inventor · disambiguated record
Young-Seop Rah
Also filed as: RAH YOUNG-SEOP
10 granted patents·1 pending application·353 citations·filing 2006–2013
88Inventor score
Top patents by PatentIndex Score
11 records- 0198US7589375B2Non-volatile memory devices including etching protection layers and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 15, 2009·271 cites·21 claims
- 0293US7646664B2Semiconductor device with three-dimensional array structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 12, 2010·35 cites·24 claims
- 0391US7602028B2NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·23 cites·18 claims
- 0490US8368182B2Semiconductor devices including patternsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 5, 2013·16 cites·19 claims
- 0577US8343812B2Contact structures in substrate having bonded interface, semiconductor device including the same, methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 1, 2013·4 cites·9 claims
- 0676US9202932B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 1, 2015·4 cites·20 claims
- 0765US7671389B2SRAM devices having buried layer patternsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 2, 2010·0 cites·9 claims
- 0859US8048727B2Methods of forming SRAM devices having buried layer patternsSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 1, 2011·0 cites·16 claims
- 0953US8035152B2Semiconductor device having shared bit line structureSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 11, 2011·0 cites·14 claims
- 1046US2010012980A1Contact Structures in Substrate Having Bonded Interface, Semiconductor Device Including the Same, Methods of Fabricating the SameSONG MIN-SUNG·Filed 2009·Application pending·0 cites
- 1140US8486802B2Method of manufacturing semiconductor device having shared bit line structureJANG DONG-HOON·Filed 2011·Granted Jul 16, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →