Inventor · disambiguated record
Young-Hwan Shin
Also filed as: SHIN YOUNG CHUL · SHIN YOUNG-HWAN
34 granted patents·15 pending applications·435 citations·filing 1996–2025
97Inventor score
Files withSAMSUNG ELECTRO MECH23HYUNDAI MOTOR CO LTD6KIM BYOUNG-CHAN3ELECTRONICS & TELECOMMUNICATIONS RES INST2YOON KYOUNG-RO2
Top patents by PatentIndex Score
49 records- 0194USD952213SRear combination lamp for an automobileHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 17, 2022·25 cites·1 claims
- 0294US6405431B1Method for manufacturing build-up multi-layer printed circuit board by using yag laserSAMSUNG ELECTRO MECH·Filed 1999·Granted Jun 18, 2002·151 cites·22 claims
- 0393USD950817SRear combination lamp for an automobileHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 3, 2022·23 cites·1 claims
- 0493USD950816SRear combination lamp for an automobileHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 3, 2022·24 cites·1 claims
- 0591USD952212SRear combination lamp for an automobileHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 17, 2022·16 cites·1 claims
- 0691US7346982B2Method of fabricating printed circuit board having thin core layerSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 25, 2008·26 cites·3 claims
- 0785US7387917B2BGA package substrate and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 17, 2008·13 cites·6 claims
- 0883US7408261B2BGA package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Aug 5, 2008·34 cites·11 claims
- 0982US9526169B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 20, 2016·3 cites·3 claims
- 1081US11426678B2Sublimation purification apparatus and sublimation purification methodLG CHEMICAL LTD·Filed 2019·Granted Aug 30, 2022·3 cites·18 claims
- 1181US8558360B2Flip chip package and method of manufacturing the sameKIM EY YONG·Filed 2010·Granted Oct 15, 2013·9 cites·15 claims
- 1277USD951503SHead lamp for an automobileHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 10, 2022·7 cites·1 claims
- 1374US8253034B2Printed circuit board and semiconductor package with the sameKIM BYOUNG CHAN·Filed 2010·Granted Aug 28, 2012·5 cites·14 claims
- 1473USD1097248SHead lamp for automobileHYUNDAI MOTOR CO LTD·Filed 2023·Granted Oct 7, 2025·4 cites·1 claims
- 1572US9161460B2Printed circuit board and method for manufacturing the sameHA HYUNG GI·Filed 2011·Granted Oct 13, 2015·3 cites·5 claims
- 1671US6852625B2Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 8, 2005·18 cites·14 claims
- 1768US7030500B2Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 18, 2006·4 cites·4 claims
- 1867US8399801B2Method of manufacturing printed circuit boardOH HWA-SUB·Filed 2010·Granted Mar 19, 2013·3 cites·5 claims
- 1966US7802361B2Method for manufacturing the BGA package boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Sep 28, 2010·3 cites·17 claims
- 2065US7256495B2Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Aug 14, 2007·11 cites·8 claims
- 2163US8201324B2Method of manufacturing electronic component embedded circuit boardKIM BYOUNG-CHAN·Filed 2009·Granted Jun 19, 2012·2 cites·6 claims
- 2262US7768116B2Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Aug 3, 2010·2 cites·3 claims
- 2362US2025232183A1Method and apparatus for performing multi-agent meta reinforcement learningELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 2461US7629692B2Via hole having fine hole land and method for forming the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 8, 2009·1 cites·4 claims
- 2559US8144972B2Manufacturing method of printed circuit board and manufacturing apparatus for the sameCHO CHUNG WOO·Filed 2008·Granted Mar 27, 2012·2 cites·8 claims
- 2659US7795719B2Electro component packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 14, 2010·1 cites·5 claims
- 2759US5837427AMethod for manufacturing build-up multi-layer printed circuit boardSAMSUNG ELECTRO MECHANICS CO C·Filed 1996·Granted Nov 17, 1998·35 cites·17 claims
- 2857US2025292122A1Apparatus and method for distributed multi-agent reinforcement learningELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 2955USD952210SHead lamp for an automobileKIA MOTORS CORP·Filed 2020·Granted May 17, 2022·2 cites·1 claims
- 3054US7208349B2Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 24, 2007·5 cites·6 claims
- 3151US8809122B2Method of manufacturing flip chip packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 19, 2014·0 cites·15 claims
- 3251US2010147575A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3351US2012134125A1Method of manufacturing electronic component embedded circuit boardKIM BYOUNG-CHAN·Filed 2012·Application pending·0 cites
- 3450US2008223610A1Bga package substrate and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3548US2008209722A1Method for forming via hole having fine hole landSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3645US7807215B2Method of manufacturing copper-clad laminate for VOP applicationSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 5, 2010·0 cites·6 claims
- 3745US7298887B2System for and method of analyzing surface condition of PCB using RGB colorsSAMSUNG ELECTRO MECH·Filed 2003·Granted Nov 20, 2007·0 cites·9 claims
- 3845US2012244662A1Board on chip package substrate and manufacturing method thereofKIM JI-EUN·Filed 2012·Application pending·0 cites
- 3943US2022128063A1Dual blade blowerSHIN YOUNG HWAN·Filed 2020·Application pending·0 cites
- 4042US8236690B2Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball padYOON KYOUNG RO·Filed 2010·Granted Aug 7, 2012·0 cites·3 claims
- 4142US2011110058A1Board on chip package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4242US2012043128A1Printed circuit board and method of manufacturing the sameYOON KYOUNG RO·Filed 2011·Application pending·0 cites
- 4340US8084696B2Printed circuit board and manufacturing method thereofKIM TAE-GUI·Filed 2009·Granted Dec 27, 2011·0 cites·6 claims
- 4438US8106308B2Printed circuit board for package and manufacturing method thereofJEON HYUNG-JIN·Filed 2007·Granted Jan 31, 2012·0 cites·11 claims
- 4537US2005051895A1BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Application pending·0 cites
- 4636US2003117258A1Thin film chip resistor and method for fabricating the sameSAMSUNG ELECTRO MECH·Filed 2002·Application pending·0 cites
- 4735US2011101510A1Board on chip package substrate and manufacturing method thereofYOON KYUNG-RO·Filed 2010·Application pending·0 cites
- 4835US2011266671A1Substrate for a semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4931US2017179084A1Light emitting diode moduleLUMENS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →