Method of manufacturing electronic component embedded circuit board

Abstract

An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.

1 . An electronic component embedded printed circuit board comprising:
 an insulator;   a first circuit pattern buried in one side of the insulator;   an electronic component embedded in the insulator and flip-chip bonded with the first circuit pattern; and   a second circuit pattern buried in an other side of the insulator.   
     
     
         2 . The electronic component embedded printed circuit board of  claim 1 , wherein the electronic component is flip-chip bonded with the first circuit pattern using a solder bump or a gold stud bump. 
     
     
         3 - 6 . (canceled) 
     
     
         7 . An electronic component embedded printed circuit board comprising:
 an insulator;   a first circuit pattern buried in one side of the insulator;   a first electronic component embedded in the insulator and flip-chip bonded with the first circuit pattern;   a second circuit pattern buried in an other side of the insulator; and   a second electronic component embedded in the insulator and connected with the second circuit pattern.   
     
     
         8 . The electronic component embedded printed circuit board of  claim 7 , wherein the first electronic component is flip-chip bonded with the first circuit pattern using a solder bump or a gold stud bump. 
     
     
         9 . The electronic component embedded printed circuit board of  claim 7 , wherein the second electronic component is flip-chip bonded with the second circuit pattern. 
     
     
         10 . The electronic component embedded printed circuit board of  claim 7 , further comprising an adhesive part interposed between the first electronic component and the second electronic component, the adhesive part being made of a different material from that of the insulator. 
     
     
         11 - 17 . (canceled)