Inventor · disambiguated record
Young Jae Song
Also filed as: SONG YOUNG J · SONG YOUNG JAE
37 granted patents·8 pending applications·1,393 citations·filing 1994–2025
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD26SAMSUNG ELECTRO MECH13LIVSMED INC3LEE SEON GOO2RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV1
Top patents by PatentIndex Score
45 records- 0197US9631857B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 25, 2017·22 cites·19 claims
- 0297US9568238B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 14, 2017·60 cites·13 claims
- 0396US11808513B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·15 claims
- 0496US11226151B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·12 claims
- 0596US9810475B2Refrigerator and method of fabricating inner door thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 7, 2017·33 cites·18 claims
- 0695US6552423B2Higher-density memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 22, 2003·219 cites·29 claims
- 0795US5710064AMethod for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Jan 20, 1998·276 cites·3 claims
- 0894US10337785B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 2, 2019·9 cites·20 claims
- 0994US6087722AMulti-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 11, 2000·260 cites·11 claims
- 1093US10690394B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 23, 2020·7 cites·15 claims
- 1193US9982936B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·8 cites·11 claims
- 1293US7242035B2Side view LED package having lead frame structure designed to improve resin flowSAMSUNG ELECTRO MECH·Filed 2005·Granted Jul 10, 2007·25 cites·11 claims
- 1392US9279609B2Refrigerator and method of manufacturing inner door thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 8, 2016·33 cites·19 claims
- 1490US5897339ALead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 27, 1999·122 cites·10 claims
- 1586US2025375255A1Robot arm for surgeryLIVSMED INC·Filed 2025·Application pending·0 cites
- 1685US5776799ALead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jul 7, 1998·84 cites·16 claims
- 1784US12169093B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·8 claims
- 1883US12419708B2Robot arm for surgeryLIVSMED INC·Filed 2024·Granted Sep 23, 2025·0 cites·22 claims
- 1982USD528998SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Sep 26, 2006·30 cites·1 claims
- 2080US7663199B2High power light emitting diode package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 16, 2010·9 cites·43 claims
- 2178US9368177B2Magnetic resistance structure, method of manufacturing the magnetic resistance structure, and electronic device including the magnetic resistance structureSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·6 cites·15 claims
- 2277US9091476B2Refrigerator and method of manufacturing inner door thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 28, 2015·5 cites·18 claims
- 2376US5834832APacking structure of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·52 cites·15 claims
- 2475USD568261SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Granted May 6, 2008·22 cites·1 claims
- 2574US8202746B2Method of manufacturing LED package for formation of molding memberLEE SEON GOO·Filed 2008·Granted Jun 19, 2012·7 cites·5 claims
- 2670US10024592B2Refrigerator and method of fabricating inner door thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·1 cites·7 claims
- 2767US9287116B2Method of forming multilayer graphene structureSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 15, 2016·2 cites·16 claims
- 2865USD522468SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 6, 2006·14 cites·1 claims
- 2960USD533517SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Dec 12, 2006·12 cites·1 claims
- 3058US11447393B2Graphene and method for preparing sameRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2020·Granted Sep 20, 2022·0 cites·18 claims
- 3158US2025169906A1Surgical instrument and surgical robot comprising sameLIVSMED INC·Filed 2023·Application pending·0 cites
- 3257US5923957AProcess for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesiveSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jul 13, 1999·26 cites·10 claims
- 3354US9709306B2Suction pipe and capillary tube arrangement for a refrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 18, 2017·1 cites·10 claims
- 3454US2009283792A1Side view light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3553US10096756B2Side view light emitting diode packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 9, 2018·0 cites·10 claims
- 3653US9515143B2Heterogeneous layered structure, method of preparing the heterogeneous layered structure, and electronic device including the heterogeneous layered structureSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 6, 2016·0 cites·8 claims
- 3749USD538760SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 20, 2007·8 cites·1 claims
- 3849US2007120234A1Side view light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3945US5849607AProcess for attaching a lead frame to a semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Dec 15, 1998·14 cites·3 claims
- 4044USD521951SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2005·Granted May 30, 2006·5 cites·1 claims
- 4143US2008179616A1LED packageLEE SEON GOO·Filed 2008·Application pending·0 cites
- 4241US5559305ASemiconductor package having adjacently arranged semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Sep 24, 1996·14 cites·14 claims
- 4341US2007171673A1Side view LED package and backlight unit using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4440US2007018191A1Side view LED with improved arrangement of protection deviceSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4539US2006267040A1High-brightness LED with protective function of electrostatic discharge damageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →