Inventor · disambiguated record
Yoshio Takagi
Also filed as: TAKAGI YOSHIO
21 granted patents·2 pending applications·597 citations·filing 1983–2022
96Inventor score
Files withMITSUBISHI ELECTRIC CORP11TOYOTA MOTOR CO LTD4ADVANCED COMPOSITE CORP3NIPPON KOKAN KK2AISIN SEIKI1
Top patents by PatentIndex Score
23 records- 0193USD401912SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 1, 1998·54 cites·1 claims
- 0293USD394244SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 12, 1998·56 cites·1 claims
- 0389US4666786ASliding surface of composite nickel-plated sliding memberAISIN SEIKI·Filed 1985·Granted May 19, 1987·64 cites·3 claims
- 0483US4954175APigmentTOYOTA MOTOR CO LTD·Filed 1989·Granted Sep 4, 1990·26 cites·11 claims
- 0579US5834842ASemiconductor device, semiconductor module, and radiating finMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 10, 1998·58 cites·15 claims
- 0674US4746412AIron-phosphorus electroplating bath and electroplating method using sameUEMURA KOGYO KK·Filed 1986·Granted May 24, 1988·27 cites·17 claims
- 0772US5686758ASemiconductor device having integral structure of case and external connection terminalsMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Nov 11, 1997·44 cites·16 claims
- 0871USD531324SBuilding board materialHANDY TECHNO CO LTD·Filed 2005·Granted Oct 31, 2006·21 cites·1 claims
- 0969US5424579ASemiconductor device having low floating inductanceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 13, 1995·41 cites·22 claims
- 1068US4976787APigmentTOYOTA MOTOR CO LTD·Filed 1990·Granted Dec 11, 1990·16 cites·4 claims
- 1167US5672910ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 30, 1997·36 cites·18 claims
- 1266US5028363AMethod of casting powder materialsNIPPON KOKAN KK·Filed 1990·Granted Jul 2, 1991·19 cites·11 claims
- 1365US5747876ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 5, 1998·32 cites·20 claims
- 1465US4885629ASemiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Dec 5, 1989·25 cites·4 claims
- 1563US5773883ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 30, 1998·30 cites·10 claims
- 1663US4927600AMethod for molding of powdersNIPPON KOKAN KK·Filed 1987·Granted May 22, 1990·24 cites·4 claims
- 1759US4954176APigmentTOYOTA MOTOR CO LTD·Filed 1988·Granted Sep 4, 1990·11 cites·27 claims
- 1854US12325065B2Method for manufacturing metal matrix composite materialADVANCED COMPOSITE CORP·Filed 2022·Granted Jun 10, 2025·0 cites·6 claims
- 1951US2025109461A1Metal-coated metal-matrix composite and manufacturing method of metal-coated metal-matrix compositeADVANCED COMPOSITE CORP·Filed 2022·Application pending·0 cites
- 2048US2024157441A1Joint structure of dissimilar metal materials and method for joining dissimilar metal materialsADVANCED COMPOSITE CORP·Filed 2022·Application pending·0 cites
- 2136US4979991AProduction process of pigmentTOYOTA MOTOR CO LTD·Filed 1989·Granted Dec 25, 1990·2 cites·10 claims
- 2236US4646125ASemiconductor device including Darlington connectionsMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Feb 24, 1987·6 cites·4 claims
- 2333US4796076ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Jan 3, 1989·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →