Inventor · disambiguated record
Yoshimi Takahashi
Also filed as: TAKAHASHI YOSHIMI
30 granted patents·11 pending applications·268 citations·filing 1983–2012
97Inventor score
Top patents by PatentIndex Score
41 records- 0197US8017439B2Dual carrier for joining IC die or wafers to TSV wafersTEXAS INSTRUMENTS INC·Filed 2010·Granted Sep 13, 2011·26 cites·20 claims
- 0295US7520052B2Method of manufacturing a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2006·Granted Apr 21, 2009·33 cites·27 claims
- 0393US7147447B1Plastic semiconductor package having improved control of dimensionsTEXAS INSTRUMENTS INC·Filed 2005·Granted Dec 12, 2006·25 cites·4 claims
- 0492US7915080B2Bonding IC die to TSV wafersTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 29, 2011·30 cites·16 claims
- 0588US9518587B2Air compressorYOKOTA TOMOYOSHI·Filed 2012·Granted Dec 13, 2016·8 cites·11 claims
- 0687US8034660B2PoP precursor with interposer for top package bond pad pitch compensationTEXAS INSTRUMENTS INC·Filed 2009·Granted Oct 11, 2011·13 cites·21 claims
- 0782US5144900AControl device for sewing machineJUKI KK·Filed 1990·Granted Sep 8, 1992·16 cites·5 claims
- 0880US8048358B2Pop semiconductor device manufacturing methodTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 1, 2011·12 cites·11 claims
- 0979US7971351B2Method of manufacturing a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2009·Granted Jul 5, 2011·6 cites·21 claims
- 1075US6985336B2Magnetic reproducing head having a structure to inhibit electrostatic discharge to a recording tapeSONY CORP·Filed 2005·Granted Jan 10, 2006·2 cites·1 claims
- 1174US8622788B2Dust collecting coverETO NAOYA·Filed 2009·Granted Jan 7, 2014·6 cites·8 claims
- 1273US8193644B2Pop precursor with interposer for top package bond pad pitch compensationTAKAHASHI YOSHIMI·Filed 2011·Granted Jun 5, 2012·3 cites·11 claims
- 1372US7009819B2Magnetic reproducing head having a structure to inhibit electrostatic discharge damage to a recording tapeSONY CORP·Filed 2002·Granted Mar 7, 2006·7 cites·9 claims
- 1469US8470641B2Exposed moldTAKAHASHI YOSHIMI·Filed 2009·Granted Jun 25, 2013·4 cites·12 claims
- 1569US4755899AMagnetic transducer head having an alloy thin film of high saturation magnetic flux density slantly provided with respect to an operating magnetic gap formed thereinSONY CORP·Filed 1984·Granted Jul 5, 1988·15 cites·29 claims
- 1667US8278142B2Combined metallic bonding and molding for electronic assemblies including void-reduced underfillTAKAHASHI YOSHIMI·Filed 2009·Granted Oct 2, 2012·4 cites·21 claims
- 1765US5603272ATwo-needle type sewing machineJUKI KK·Filed 1995·Granted Feb 18, 1997·12 cites·9 claims
- 1864US7632945B2Cyanine dyeHAYASHIBARA BIOCHEM LAB·Filed 2004·Granted Dec 15, 2009·5 cites·2 claims
- 1958US9082545B2Antenna device and communication deviceSUGITA SATORU·Filed 2011·Granted Jul 14, 2015·1 cites·4 claims
- 2058US7789466B2Chair-type massage machinePANASONIC ELEC WORKS CO LTD·Filed 2007·Granted Sep 7, 2010·6 cites·15 claims
- 2158US4830525ATypewriter with pivoting keyboardSILVER SEIKO·Filed 1988·Granted May 16, 1989·12 cites·5 claims
- 2255US2010044883A1Plastic Semiconductor Package Having Improved Control of DimensionsTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 2353US7189601B2System and method for forming mold caps over integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 13, 2007·5 cites·12 claims
- 2451US7629696B2Plastic semiconductor package having improved control of dimensionsTEXAS INSTRUMENTS INC·Filed 2006·Granted Dec 8, 2009·0 cites·9 claims
- 2550US8974191B2Air compressorMIURA MASAHIRO·Filed 2012·Granted Mar 10, 2015·0 cites·12 claims
- 2650US8304883B2Semiconductor device having multiple semiconductor elementsTAKAHASHI YOSHIMI·Filed 2011·Granted Nov 6, 2012·0 cites·2 claims
- 2748US2009289360A1Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of ic during pressingTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 2848US2010159699A1Sandblast etching for through semiconductor viasTAKAHASHI YOSHIMI·Filed 2009·Application pending·0 cites
- 2948US2004264689A1Telephone equipped with speakerUNIDEN KK·Filed 2003·Application pending·0 cites
- 3045US8410989B2Antenna structure including radiating conductor and magnetic material having dielectric propertyHAYAKAWA MASATOSHI·Filed 2006·Granted Apr 2, 2013·1 cites·11 claims
- 3144US2007087274A1Wiring correction methodLASERFRONT TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 3241US2012157899A1MassagerTERADA KOJI·Filed 2010·Application pending·0 cites
- 3339US4566323ALiquid helium level indicating gaugeAISIN SEIKI·Filed 1983·Granted Jan 28, 1986·7 cites·4 claims
- 3439US2007243667A1POP Semiconductor Device Manufacturing MethodTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 3539US2012157898A1MassagerWATANABE TOMOHIKO·Filed 2010·Application pending·0 cites
- 3634US5663981ARadio communication apparatusUNIDEN KK·Filed 1995·Granted Sep 2, 1997·5 cites·16 claims
- 3734US2011316316A1Massage chairNANNO TOSHIAKI·Filed 2010·Application pending·0 cites
- 3834US2011278890A1Massage chairTAKAHASHI YOSHIMI·Filed 2010·Application pending·0 cites
- 3932US2014117469A1Tsv-mems combinationTEXAS INSTRUMENTS INC·Filed 2012·Application pending·0 cites
- 4026US5838721ASpread spectrum communication equipmentUNIDEN KK·Filed 1997·Granted Nov 17, 1998·2 cites·11 claims
- 4125US5671248ASpread spectrum communication equipmentUNIDEN KK·Filed 1994·Granted Sep 23, 1997·2 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Yoshimi Takahashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →