Inventor · disambiguated record
Yoshiaki Tsubomatsu
Also filed as: TSUBOMATSU YOSHIAKI
14 granted patents·2 pending applications·1,173 citations·filing 1987–2013
95Inventor score
Top patents by PatentIndex Score
16 records- 0198US5976912AFabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 2, 1999·519 cites·4 claims
- 0294US7187072B2Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2003·Granted Mar 6, 2007·52 cites·9 claims
- 0391US6365432B1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 2, 2002·41 cites·4 claims
- 0491US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0591US5426850AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jun 27, 1995·79 cites·3 claims
- 0687US6746897B2Fabrication process of semiconductor package and semiconductor packageFiled 2001·Granted Jun 8, 2004·27 cites·14 claims
- 0785US6064111ASubstrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI COMPANY LTD·Filed 1997·Granted May 16, 2000·84 cites·11 claims
- 0884US6133534AWiring board for electrical tests with bumps having polymeric coatingHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 2000·56 cites·2 claims
- 0982US4830691AProcess for producing high-density wiring boardHITACHI CHEMICAL CO LTD·Filed 1987·Granted May 16, 1989·52 cites·17 claims
- 1081US8997341B2Substrate for mounting semiconductor chip and method for producing sameEJIRI YOSHINORI·Filed 2010·Granted Apr 7, 2015·7 cites·12 claims
- 1178US6236108B1Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 22, 2001·24 cites·14 claims
- 1274US6568073B1Process for the fabrication of wiring board for electrical testsHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 27, 2003·37 cites·5 claims
- 1366US5664325AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 9, 1997·25 cites·4 claims
- 1455US5504992AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 9, 1996·25 cites·3 claims
- 1541US2002094606A1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 1637US2016252675A1Optical waveguide, optical waveguide manufacturing method, and optical moduleSAKAI DAICHI·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →