Inventor · disambiguated record
Yoshio Tsukiyama
Also filed as: TSUKIYAMA YOSHIO
4 granted patents·1 pending application·23 citations·filing 2000–2021
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0167US6489679B2High-frequency packageSUMITOMO METAL SMI ELECTRONICS·Filed 2000·Granted Dec 3, 2002·23 cites·13 claims
- 0245US11978682B2Package, and method for manufacturing power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Granted May 7, 2024·0 cites·8 claims
- 0345US11901268B2Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewithNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Feb 13, 2024·0 cites·11 claims
- 0445US2022020651A1Power semiconductor module and manufacturing method for power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Application pending·0 cites
- 0528US6781488B2Connected construction of a high-frequency package and a wiring boardSUMITOMO METAL SMI ELECTRONICS·Filed 2002·Granted Aug 24, 2004·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →