Inventor · disambiguated record
Yoji Wakayama
Also filed as: WAKAYAMA YOJI
6 granted patents·2 pending applications·11 citations·filing 2007–2014
75Inventor score
Top patents by PatentIndex Score
8 records- 0172US9296925B2Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor deviceLINTEC CORP·Filed 2013·Granted Mar 29, 2016·3 cites·9 claims
- 0268US8735881B1Resin film forming sheet for chip, and method for manufacturing semiconductor chipLINTEC CORP·Filed 2014·Granted May 27, 2014·2 cites·8 claims
- 0366US8674349B2Resin film forming sheet for chip, and method for manufacturing semiconductor chipSHINODA TOMONORI·Filed 2011·Granted Mar 18, 2014·3 cites·10 claims
- 0463US8114520B2Laser dicing sheet and process for producing chip bodyWAKAYAMA YOJI·Filed 2007·Granted Feb 14, 2012·3 cites·18 claims
- 0554US9878520B2Adhesive sheetOHASHI HITOSHI·Filed 2008·Granted Jan 30, 2018·0 cites·4 claims
- 0650US8174130B2Laser dicing sheet and manufacturing method for chip bodySATO YOSUKE·Filed 2007·Granted May 8, 2012·0 cites·20 claims
- 0746US2011045290A1Adhesive SheetLINTEC CORP·Filed 2009·Application pending·0 cites
- 0843US2009261084A1Laser Dicing Sheet and Manufacturing Method For Chip BodyLINTEC CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →