Inventor · disambiguated record
Yoshihide Yamaguchi
Also filed as: YAMAGUCHI YOSHIHIDE
34 granted patents·12 pending applications·778 citations·filing 1993–2022
98Inventor score
Files withRENESAS TECH CORP13HITACHI LTD11HITACHI HIGH TECH CORP10HITACHI VIA MECHANICS LTD3YAMAGUCHI YOSHIHIDE2
Top patents by PatentIndex Score
46 records- 0196US6780748B2Method of fabricating a wafer level chip size package utilizing a maskless exposureHITACHI LTD·Filed 2002·Granted Aug 24, 2004·150 cites·20 claims
- 0294US11515169B2Method of making a semiconductor device including etching of a metal silicate using sequential and cyclic application of reactive gasesHITACHI HIGH TECH CORP·Filed 2021·Granted Nov 29, 2022·2 cites·11 claims
- 0393US6791178B2Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 14, 2004·77 cites·19 claims
- 0492US6861742B2Wafer level chip size package having rerouting layersRENESAS TECH CORP·Filed 2002·Granted Mar 1, 2005·64 cites·19 claims
- 0592US6610934B2Semiconductor module and method of making the deviceHITACHI LTD·Filed 2001·Granted Aug 26, 2003·67 cites·14 claims
- 0690US6515372B1Wiring board and its production method, semiconductor device and its production method, and electronic apparatusHITACHI LTD·Filed 2000·Granted Feb 4, 2003·44 cites·17 claims
- 0789US9001528B2Shielded electronic components and method of manufacturing the sameYORITA CHIKO·Filed 2012·Granted Apr 7, 2015·16 cites·9 claims
- 0886US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 0986US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 1083US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 1183US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 1281US10460953B2Semiconductor manufacturing apparatus for manufacturing a semiconductor device having a high-K insulating film, and a method for manufacturing the semiconductor deviceHITACHI HIGH TECH CORP·Filed 2018·Granted Oct 29, 2019·2 cites·7 claims
- 1381US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 1479US7839484B2Exposure apparatus and exposure method, and method of manufacturing electrical wiring boardHITACHI VIA MECHANICS LTD·Filed 2006·Granted Nov 23, 2010·5 cites·2 claims
- 1578US11380523B2Semiconductor manufacturing apparatusHITACHI HIGH TECH CORP·Filed 2019·Granted Jul 5, 2022·2 cites·7 claims
- 1676US6595404B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2001·Granted Jul 22, 2003·18 cites·3 claims
- 1775US6695200B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2002·Granted Feb 24, 2004·16 cites·12 claims
- 1872US11515167B2Plasma etching method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2019·Granted Nov 29, 2022·1 cites·14 claims
- 1972US6720591B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·16 cites·19 claims
- 2071US5480048AMultilayer wiring board fabricating methodHITACHI LTD·Filed 1993·Granted Jan 2, 1996·49 cites·55 claims
- 2168US6946723B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Sep 20, 2005·13 cites·13 claims
- 2265US8992665B2Metal recovery method and dialysis deviceYAMAGUCHI YOSHIHIDE·Filed 2010·Granted Mar 31, 2015·3 cites·23 claims
- 2364US7002250B2Semiconductor moduleRENESAS TECH CORP·Filed 2001·Granted Feb 21, 2006·14 cites·28 claims
- 2464US6756688B2Wiring board and its production method, semiconductor device and its production method, and electronic apparatusHITACHI LTD·Filed 2002·Granted Jun 29, 2004·8 cites·26 claims
- 2562US6949416B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Sep 27, 2005·9 cites·12 claims
- 2661US10910230B2Semiconductor manufacturing apparatus and method for manufacturing semiconductor deviceHITACHI HIGH TECH CORP·Filed 2019·Granted Feb 2, 2021·0 cites·6 claims
- 2759US7569967B2Compact disk device and disk driveHITACHI GLOBAL STORAGE TECH·Filed 2006·Granted Aug 4, 2009·2 cites·4 claims
- 2859US7084498B2Semiconductor device having projected electrodes and structure for mounting the sameRENESAS TECH CORP·Filed 2002·Granted Aug 1, 2006·9 cites·36 claims
- 2958US7459201B2Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit boardHITACHI CABLE·Filed 2004·Granted Dec 2, 2008·3 cites·9 claims
- 3055US2025038005A1Semiconductor device manufacturing method and semiconductor manufacturing apparatusHITACHI HIGH TECH CORP·Filed 2022·Application pending·0 cites
- 3153US2019131120A1Semiconductor manufacturing apparatus and method for manufacturing semiconductor deviceHITACHI HIGH TECH CORP·Filed 2018·Application pending·0 cites
- 3252US6998713B2Wiring board and method for producing sameRENESAS TECH CORP·Filed 2004·Granted Feb 14, 2006·3 cites·10 claims
- 3352US2010172116A1Shielded electronic components and method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 3451US11915939B2Semiconductor fabricating methodHITACHI HIGH TECH CORP·Filed 2020·Granted Feb 27, 2024·0 cites·10 claims
- 3550US2006091553A1Wiring board and method for producing sameHITACHI LTD·Filed 2005·Application pending·0 cites
- 3650US2024258115A1Semiconductor manufacturing method and semiconductor manufacturing apparatusHITACHI HIGH TECH CORP·Filed 2021·Application pending·0 cites
- 3750US2007298161A1Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit boardYAMAGUCHI YOSHIHIDE·Filed 2007·Application pending·0 cites
- 3848US6946327B2Semiconductor device and manufacturing method of thatRENESAS TECH CORP·Filed 2004·Granted Sep 20, 2005·2 cites·7 claims
- 3948US2023027528A1Semiconductor manufacturing method and semiconductor manufacturing apparatusHITACHI HIGH TECH CORP·Filed 2020·Application pending·0 cites
- 4046US7378333B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·0 cites·19 claims
- 4146US2009111062A1Pattern Formation MethodHITACHI VIA MECHANICS LTD·Filed 2008·Application pending·0 cites
- 4245US7760328B2Exposure apparatus and exposing method and method of manufacturing a printed wiring boardHITACHI VIA MECHANICS LTD·Filed 2006·Granted Jul 20, 2010·0 cites·5 claims
- 4345US2013206607A1Lithium Extraction Method, and Metal Recovery MethodKOJIMA YASUKO·Filed 2011·Application pending·0 cites
- 4442US2005147917A1Etching resist precursor compound, fabrication method of circuit board using the same and circuit boardFiled 2004·Application pending·0 cites
- 4541US2013287654A1Leaching solution and metal recovery methodYAMADA YASUKO·Filed 2011·Application pending·0 cites
- 4635US2011237001A1Semiconductor chip used for evaluation, evaluation system, and repairing method thereofHASEBE TAKEHIKO·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshihide Yamaguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →