Shielded electronic components and method of manufacturing the same

Abstract

A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO 2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

1 . A shielded electronic component comprising:
 a wiring board;   a semiconductor integrated circuit device mounted on a main surface of the wiring board;   a sealant which seals the whole of an upper surface of the wiring board; and   a metal plating film formed on an upper surface of the sealant, wherein   the metal plating film is formed on a pretreatment layer formed only on the upper surface of the sealant with using high-pressure CO 2  in a state of protecting a back surface of the wiring board, and electrically connected with an end portion of a ground wiring layer on a side surface of the wiring board or a ground connection through-hole connected to the end portion of the ground wiring layer.   
     
     
         2 . The shielded electronic component according to  claim 1 , wherein
 the metal plating film is formed with mixing high-pressure CO 2  and a plating solution.   
     
     
         3 . The shielded electronic component according to  claim 1 , wherein
 the pretreatment layer contains palladium.   
     
     
         4 . The shielded electronic component according to  claim 1 , wherein
 the metal plating film is formed of a copper plating film or a nickel plating film.   
     
     
         5 . A method of manufacturing a shielded electronic component comprising the steps of:
 mounting a semiconductor integrated circuit device configuring the shielded electronic component on a board for forming a plurality of the shielded electronic components;   forming a sealant on the whole of an upper surface of the board;   performing half-cut dicing on the board at a cutting portion of the individual shielded electronic component until reaching a ground wiring layer of the board or a ground connection through-hole connected with the ground wiring layer;   attaching back surfaces of two of the half-cut diced boards to each other and fixing end portions of the two boards by an adhesive;   forming a pretreatment layer on an upper surface of the sealant with using high-pressure CO 2 ;   forming a metal plating film on the pretreatment layer to be electrically connected with the ground wiring layer of the board or the ground connection through-hole connected with the ground wiring layer;   cutting off the adhering portion by the adhesive; and   performing full-cut dicing on the half-cut diced portion to cut out the individual shielded electronic component.   
     
     
         6 . A method of manufacturing a shielded electronic component comprising the steps of:
 mounting a semiconductor integrated circuit device configuring the shielded electronic component on a board for forming a plurality of the shielded electronic components;   forming a sealant on the whole of an upper surface of the board;   performing half-cut dicing on the board at a cutting portion of the individual shielded electronic component until reaching a ground wiring layer of the board or a ground connection through-hole connected with the ground wiring layer;   applying a protective film on a back surface of the half-cut diced board;   fixing end portions of the board and the protective film by an adhesive;   forming a pretreatment layer on an upper surface of the sealant with using high-pressure CO 2 ;   forming a metal plating film on the pretreatment layer to be electrically connected with the ground wiring layer of the board or the ground connection through-hole connected with the ground wiring layer;   cutting off the adhering portion by the adhesive and exfoliating the protective film; and   performing full-cut dicing on the half-cut diced portion to cut out the individual shielded electronic component.