Inventor · disambiguated record
Yoshiyuki Yamamoto
Also filed as: YAMAMOTO YOSHIYUKI
99 granted patents·18 pending applications·1,506 citations·filing 1982–2022
99Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES73TORAY INDUSTRIES10MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9SATOH ISSEI5FUJIWARA SHINSUKE2
Top patents by PatentIndex Score
117 records- 0198US7294587B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 13, 2007·64 cites·10 claims
- 0298US6784530B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 31, 2004·169 cites·11 claims
- 0397US6975516B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 13, 2005·110 cites·26 claims
- 0495US7018866B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·83 cites·15 claims
- 0594US6855892B2Insulation sheet, multi-layer wiring substrate and production processes thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 15, 2005·62 cites·44 claims
- 0694US5677372ADiamond reinforced composite materialSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 14, 1997·96 cites·23 claims
- 0791US7481879B2Diamond single crystal substrate manufacturing method and diamond single crystal substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Jan 27, 2009·8 cites·14 claims
- 0889US7141884B2Module with a built-in semiconductor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 28, 2006·43 cites·27 claims
- 0987US7390695B2Diamond substrate and manufacturing method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jun 24, 2008·12 cites·44 claims
- 1086US7821795B2Multilayer wiring boardPANASONIC CORP·Filed 2006·Granted Oct 26, 2010·16 cites·8 claims
- 1186US7524372B2Method for manufacturing diamond single crystal substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Apr 28, 2009·5 cites·10 claims
- 1286US6129145AHeat dissipator including coolant passage and method of fabricating the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Oct 10, 2000·81 cites·24 claims
- 1384US8697564B2Method of manufacturing GaN-based filmFUJIWARA SHINSUKE·Filed 2011·Granted Apr 15, 2014·2 cites·4 claims
- 1484US5878110AX-ray generation apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Mar 2, 1999·41 cites·23 claims
- 1583US7995267B2Wavelength converter manufacturing method and wavelength converterSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Aug 9, 2011·7 cites·7 claims
- 1683US6316826B1Semiconductor mounting packageSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Nov 13, 2001·71 cites·36 claims
- 1782US4461871APolyester resinous composition, molded articles and process for preparation thereofTORAY INDUSTRIES·Filed 1982·Granted Jul 24, 1984·33 cites·25 claims
- 1881US10600676B2Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Mar 24, 2020·2 cites·14 claims
- 1980US11758813B2Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module, optical sensor, and method for manufacturing thermoelectric conversion materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Sep 12, 2023·2 cites·15 claims
- 2078US7807126B2Diamond single crystal substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Oct 5, 2010·2 cites·2 claims
- 2178US5642779AHeat sink and a process for the production of the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jul 1, 1997·50 cites·9 claims
- 2277US11692264B2Method of manufacturing diamond substrate, diamond substrate, and diamond composite substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Granted Jul 4, 2023·0 cites·2 claims
- 2377US10822693B2Method of manufacturing diamond substrate, diamond substrate, and diamond composite substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Nov 3, 2020·1 cites·12 claims
- 2476US7737614B2Diamond electron emission cathode, electron emission source, electron microscope, and electron beam exposure deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jun 15, 2010·3 cites·30 claims
- 2576US7157789B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 2, 2007·7 cites·30 claims
- 2675US9923063B2Group III nitride composite substrate and method for manufacturing the same, laminated group III nitride composite substrate, and group III nitride semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Mar 20, 2018·3 cites·14 claims
- 2775US6641861B2Heatsink and fabrication method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Nov 4, 2003·19 cites·15 claims
- 2874US9917004B2Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Mar 13, 2018·2 cites·9 claims
- 2974US8367577B2Thin film of aluminum nitride and process for producing the thin film of aluminum nitrideSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Feb 5, 2013·1 cites·5 claims
- 3074US5657365AX-ray generation apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Aug 12, 1997·44 cites·12 claims
- 3173US5886198AMethod for continuously producing a cyclic formalTORAY INDUSTRIES·Filed 1998·Granted Mar 23, 1999·15 cites·21 claims
- 3273US5138697AGraphic data conversion methodNIPPON STEEL CORP·Filed 1991·Granted Aug 11, 1992·64 cites·8 claims
- 3372US8653561B2III-nitride semiconductor electronic device, and method of fabricating III-nitride semiconductor electronic deviceHASHIMOTO SHIN·Filed 2011·Granted Feb 18, 2014·3 cites·48 claims
- 3472US8119241B2Method for manufacturing diamond monocrystal having a thin film, and diamond monocrystal having a thin filmUEDA AKIHIKO·Filed 2007·Granted Feb 21, 2012·4 cites·10 claims
- 3571US11359275B2Method of manufacturing diamond substrate, diamond substrate, and diamond composite substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2020·Granted Jun 14, 2022·0 cites·2 claims
- 3670US4751272AProcess for producing oxymethylene copolymer and resinous compositionTORAY INDUSTRIES·Filed 1987·Granted Jun 14, 1988·23 cites·22 claims
- 3769US10029286B2Wiper and method of manufacturing the sameNITTA CORP·Filed 2014·Granted Jul 24, 2018·1 cites·7 claims
- 3868US6361857B1Heatsink and fabrication method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Mar 26, 2002·30 cites·32 claims
- 3967US11094537B2Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2020·Granted Aug 17, 2021·0 cites·15 claims
- 4067US7863805B2Diamond electron emission cathode, electron emission source, electron microscope, and electron beam exposure deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jan 4, 2011·1 cites·59 claims
- 4166US8697550B2Method of manufacturing GaN-based filmSATOH ISSEI·Filed 2011·Granted Apr 15, 2014·2 cites·7 claims
- 4266US8259386B2Wavelength conversion element and method for manufacturing wavelength conversion elementSATOH ISSEI·Filed 2009·Granted Sep 4, 2012·2 cites·6 claims
- 4366US7902734B2Electron emission element and electron emission element fabrication methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Mar 8, 2011·1 cites·6 claims
- 4466US6335863B1Package for semiconductors, and semiconductor module that employs the packageSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Jan 1, 2002·32 cites·5 claims
- 4566US5745362ADigital PID control apparatusTOSHIBA KK·Filed 1996·Granted Apr 28, 1998·35 cites·6 claims
- 4665US11910714B2Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module and optical sensorSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Feb 20, 2024·0 cites·2 claims
- 4765US8497185B2Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that methodSEKI YUKI·Filed 2011·Granted Jul 30, 2013·2 cites·12 claims
- 4865US8323402B2Method for growing aluminum nitride crystal, process for producing aluminum nitride crystal, and aluminum nitride crystalTANIZAKI KEISUKE·Filed 2008·Granted Dec 4, 2012·3 cites·15 claims
- 4964US9184228B2Composite base including sintered base and base surface flattening layer, and composite substrate including that composite base and semiconductor crystalline layerSEKI YUKI·Filed 2011·Granted Nov 10, 2015·2 cites·7 claims
- 5063US7771693B2Diamond single crystal substrate manufacturing methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2008·Granted Aug 10, 2010·0 cites·4 claims
Showing the top 50 of 117 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →