Inventor · disambiguated record
Yoshihiko Yanagisawa
Also filed as: YANAGISAWA YOSHIHIKO
12 granted patents·9 pending applications·15 citations·filing 2006–2025
84Inventor score
Top patents by PatentIndex Score
21 records- 0196US11177143B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 16, 2021·5 cites·20 claims
- 0281US7943528B2Substrate processing apparatus and semiconductor devices manufacturing methodHITACHI INT ELECTRIC INC·Filed 2010·Granted May 17, 2011·2 cites·13 claims
- 0379US2025340983A1Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0473US8172950B2Substrate processing apparatus and semiconductor device producing methodYANAGISAWA YOSHIHIKO·Filed 2006·Granted May 8, 2012·6 cites·8 claims
- 0571US11018033B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 25, 2021·1 cites·12 claims
- 0666US12392032B2Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 19, 2025·0 cites·17 claims
- 0766US2025191921A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0862US9518321B2Atomic layer deposition processing apparatus to reduce heat energy conductionHITACHI INT ELECTRIC INC·Filed 2014·Granted Dec 13, 2016·1 cites·4 claims
- 0961US12255069B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 18, 2025·0 cites·9 claims
- 1057US8222161B2Substrate processing apparatus and semiconductor devices manufacturing methodYANAGISAWA YOSHIHIKO·Filed 2011·Granted Jul 17, 2012·0 cites·12 claims
- 1155US2024249960A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1255US2023307267A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1352US11309195B2Heating element, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 19, 2022·0 cites·18 claims
- 1451US2021407865A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1549US11127608B2Heating element, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 21, 2021·0 cites·11 claims
- 1649US2022093435A1Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1747US11265977B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 1, 2022·0 cites·11 claims
- 1841US9546422B2Semiconductor device manufacturing method and substrate processing method including a cleaning methodHITACHI INT ELECTRIC INC·Filed 2013·Granted Jan 17, 2017·0 cites·7 claims
- 1935US2017186634A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 2035US2016379848A1Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 2133US2016079101A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →