Inventor · disambiguated record
Yoshiaki Yodo
Also filed as: YODO YOSHIAKI
49 granted patents·1 pending application·23 citations·filing 2010–2021
96Inventor score
Files withDISCO CORP50
Top patents by PatentIndex Score
50 records- 0190US11289379B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 29, 2022·2 cites·12 claims
- 0289US11348797B2Stacked wafer processing methodDISCO CORP·Filed 2020·Granted May 31, 2022·2 cites·8 claims
- 0389US11222807B2Processing method and thermocompression bonding method for workpieceDISCO CORP·Filed 2020·Granted Jan 11, 2022·2 cites·5 claims
- 0486US9093519B2Wafer processing methodDISCO CORP·Filed 2014·Granted Jul 28, 2015·7 cites·6 claims
- 0582US10515840B2Expanding method and expanding apparatusDISCO CORP·Filed 2018·Granted Dec 24, 2019·3 cites·2 claims
- 0681US11024543B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 1, 2021·1 cites·13 claims
- 0780US10991624B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Apr 27, 2021·1 cites·14 claims
- 0879US10847420B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 24, 2020·2 cites·11 claims
- 0972US11037814B2Wafer processing method using a ring frame with a polyester sheet with no adhesive layerDISCO CORP·Filed 2019·Granted Jun 15, 2021·1 cites·13 claims
- 1071US11062948B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 13, 2021·1 cites·12 claims
- 1169US11823942B2Thermocompression bonding method for workpieceDISCO CORP·Filed 2021·Granted Nov 21, 2023·0 cites·10 claims
- 1262US9054179B2Wafer processing methodDISCO CORP·Filed 2014·Granted Jun 9, 2015·1 cites·5 claims
- 1360US11545393B2Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 1450US11569129B2Workpiece processing methodDISCO CORP·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 1549US11610815B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·11 claims
- 1649US11594454B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 1749US11587833B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1849US11587832B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1949US11476161B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·13 claims
- 2049US11393721B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·12 claims
- 2149US11380588B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 2249US11322407B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 2348US11380587B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 2448US11361997B2Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 2548US11322406B2Wafer processing methodDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 2648US11270916B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 2748US11049772B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 2847US11302578B2Wafer processing methodDISCO CORP·Filed 2020·Granted Apr 12, 2022·0 cites·9 claims
- 2947US11251082B2Wafer processing methodDISCO CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 3047US11056334B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 3147US11049757B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 3247US11031234B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·15 claims
- 3347US11018058B2Wafer processing method for dividing a wafer along predefined division lines using polyester sheetDISCO CORP·Filed 2020·Granted May 25, 2021·0 cites·9 claims
- 3447US11011407B2Wafer processing method using a ring frame and a polyolefin sheetDISCO CORP·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 3547US11004744B2Wafer processing method for dividing a wafer along predefined division linesDISCO CORP·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 3647US10998232B2Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheetDISCO CORP·Filed 2020·Granted May 4, 2021·0 cites·9 claims
- 3747US10991587B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·14 claims
- 3847US10985067B2Wafer processing method using a laser beam dividing stepDISCO CORP·Filed 2020·Granted Apr 20, 2021·0 cites·18 claims
- 3947US10720355B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 4046US11127633B2Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheetDISCO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 4146US11069574B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 4246US11043421B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 22, 2021·0 cites·21 claims
- 4346US11037813B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 15, 2021·0 cites·25 claims
- 4446US10985066B2Wafer processing method for dividing a wafer along division linesDISCO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·9 claims
- 4546US10910269B2Wafer processing methodDISCO CORP·Filed 2019·Granted Feb 2, 2021·0 cites·8 claims
- 4646US10896850B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jan 19, 2021·0 cites·13 claims
- 4745US11018043B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted May 25, 2021·0 cites·10 claims
- 4845US10265805B2Method of processing workpieceDISCO CORP·Filed 2018·Granted Apr 23, 2019·0 cites·3 claims
- 4938US2011034007A1Dividing method for platelike workpieceDISCO CORP·Filed 2010·Application pending·0 cites
- 5035US9449878B2Wafer processing methodDISCO CORP·Filed 2015·Granted Sep 20, 2016·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Yoshiaki Yodo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →