Inventor · disambiguated record
Yoshiyuki Yoneda
Also filed as: YONEDA YOSHIYUKI
50 granted patents·7 pending applications·3,648 citations·filing 1986–2014
99Inventor score
Files withFUJITSU LTD47FUJITSU SEMICONDUCTOR LTD5HITACHI LTD1MARUYAMA SHIGEYUKI1NIPPON PAINT CO LTD1
Top patents by PatentIndex Score
57 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0299US5625222ASemiconductor device in a resin package housed in a frame having high thermal conductivityFUJITSU LTD·Filed 1994·Granted Apr 29, 1997·1k cites·8 claims
- 0398US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0496US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0596US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0694US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0793US6794273B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·81 cites·8 claims
- 0893US6159770AMethod and apparatus for fabricating semiconductor deviceFUJITSU LTD·Filed 1998·Granted Dec 12, 2000·212 cites·9 claims
- 0992US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 1090US9076789B2Semiconductor device having a high frequency external connection electrode positioned within a via holeFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Jul 7, 2015·8 cites·7 claims
- 1189US7112889B1Semiconductor device having an alignment mark formed by the same material with a metal postFUJITSU LTD·Filed 2000·Granted Sep 26, 2006·36 cites·9 claims
- 1289US6875638B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2002·Granted Apr 5, 2005·44 cites·16 claims
- 1389US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 1488US6995044B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2003·Granted Feb 7, 2006·36 cites·8 claims
- 1588US6781224B2Semiconductor device and package including forming pyramid mount protruding through silicon substrateFUJITSU LTD·Filed 2002·Granted Aug 24, 2004·42 cites·12 claims
- 1687US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 1786US5521432ASemiconductor device having improved leads comprising palladium plated nickelFUJITSU LTD·Filed 1994·Granted May 28, 1996·84 cites·32 claims
- 1884US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 1983US5804468AProcess for manufacturing a packaged semiconductor having a divided leadframe stageFUJITSU LTD·Filed 1995·Granted Sep 8, 1998·65 cites·4 claims
- 2083US5497032ASemiconductor device and lead frame thereforeFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·65 cites·45 claims
- 2181US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 2277US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 2377US5569625AProcess for manufacturing a plural stacked leadframe semiconductor deviceFUJITSU LTD·Filed 1994·Granted Oct 29, 1996·47 cites·8 claims
- 2475US7754534B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 13, 2010·5 cites·27 claims
- 2573US6207477B1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Mar 27, 2001·37 cites·9 claims
- 2671US8759119B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Jun 24, 2014·2 cites·4 claims
- 2770US6069408ASemiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 1999·Granted May 30, 2000·32 cites·6 claims
- 2870US5750421ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1997·Granted May 12, 1998·27 cites·4 claims
- 2970US5475259ASemiconductor device and carrier for carrying semiconductor deviceFUJITSU LTD·Filed 1992·Granted Dec 12, 1995·29 cites·24 claims
- 3068US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 3168US5666064ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1995·Granted Sep 9, 1997·25 cites·7 claims
- 3267US5767527ASemiconductor device suitable for testingFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·31 cites·18 claims
- 3365US8097954B2Adhesive layer forming a capacitor dielectric between semiconductor chipsOZAWA KANAME·Filed 2006·Granted Jan 17, 2012·5 cites·6 claims
- 3463US6905951B2Method of forming a device substrate and semiconductor package including a pyramid contactFUJITSU LTD·Filed 2004·Granted Jun 14, 2005·9 cites·6 claims
- 3561US9041186B2Encapsulated semiconductor chips with wiring including controlling chip and method of making the sameFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted May 26, 2015·1 cites·19 claims
- 3661US5891758ASemiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 1997·Granted Apr 6, 1999·23 cites·16 claims
- 3759US5904506ASemiconductor device suitable for testingFUJITSU LTD·Filed 1998·Granted May 18, 1999·21 cites·4 claims
- 3857US7251801B2Method of designing circuit boardFUJITSU LTD·Filed 2004·Granted Jul 31, 2007·6 cites·7 claims
- 3956US6856017B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 15, 2005·13 cites·19 claims
- 4055US6777250B1Manufacture of wafer level semiconductor device with quality markings on the sealing resinFUJITSU LTD·Filed 2000·Granted Aug 17, 2004·6 cites·5 claims
- 4154US5654243AProcess for fabricating a semiconductor device in a resin package housed in a frame having high conductivityFUJITSU LTD·Filed 1996·Granted Aug 5, 1997·16 cites·2 claims
- 4253US8404496B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateMARUYAMA SHIGEYUKI·Filed 2006·Granted Mar 26, 2013·1 cites·2 claims
- 4353US5440170ASemiconductor device having a die pad with rounded edges and its manufacturing methodFUJITSU LTD·Filed 1991·Granted Aug 8, 1995·20 cites·6 claims
- 4453US2013082402A1Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Application pending·0 cites
- 4551US5399804ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1993·Granted Mar 21, 1995·16 cites·15 claims
- 4649US2006186524A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4747US7144754B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·1 cites·7 claims
- 4847US5808357ASemiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1995·Granted Sep 15, 1998·11 cites·14 claims
- 4947US2005244414A1Method to ameliorate osteolysis and metastasisXENOTECH INC·Filed 2005·Application pending·0 cites
- 5045US5736428AProcess for manufacturing a semiconductor device having a stepped encapsulated packageFUJITSU LTD·Filed 1997·Granted Apr 7, 1998·8 cites·8 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →