Inventor · disambiguated record
Yukiharu Akiyama
Also filed as: AKIYAMA YUKIHARU
29 granted patents·2 pending applications·799 citations·filing 1989–2006
98Inventor score
Top patents by PatentIndex Score
31 records- 0195US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0294US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0394US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0492US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0592US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0691US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 0791US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 0887US5176310AMethod and apparatus for wire bondHITACHI LTD·Filed 1992·Granted Jan 5, 1993·100 cites·12 claims
- 0986US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1085US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1185US5943595AMethod for manufacturing a semiconductor device having a triple-well structureSHARP KK·Filed 1998·Granted Aug 24, 1999·84 cites·18 claims
- 1284US5110032AMethod and apparatus for wire bondingHITACHI LTD·Filed 1991·Granted May 5, 1992·72 cites·4 claims
- 1383US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 1482US5037023AMethod and apparatus for wire bondingHITACHI LTD·Filed 1989·Granted Aug 6, 1991·53 cites·32 claims
- 1581US5884835AUltrasonic bonding method and ultrasonic bonding apparatusHITACHI LTD·Filed 1996·Granted Mar 23, 1999·60 cites·8 claims
- 1671US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 1768US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 1868US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 1967US8552545B2Manufacturing method for semiconductor device, semiconductor device and semiconductor chipTANIDA KAZUMASA·Filed 2005·Granted Oct 8, 2013·3 cites·11 claims
- 2067US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 2165US7256085B2Semiconductor memory device and manufacturing method thereofSHARP KK·Filed 2005·Granted Aug 14, 2007·2 cites·7 claims
- 2265US5880008AMethod for forming field oxide filmSHARP KK·Filed 1996·Granted Mar 9, 1999·25 cites·7 claims
- 2364US7104136B2Multi-compartment pressure sensor housing apparatusMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Sep 12, 2006·11 cites·8 claims
- 2464US5493139AElectrically erasable PROM (E2 PROM) with thin film peripheral transistorSHARP KK·Filed 1994·Granted Feb 20, 1996·23 cites·5 claims
- 2562US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 2657US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 2753US6066531AMethod for manufacturing semiconductor memory deviceSHARP KK·Filed 1998·Granted May 23, 2000·12 cites·10 claims
- 2849US8404586B2Manufacturing method for semiconductor deviceTANIDA KAZUMASA·Filed 2006·Granted Mar 26, 2013·0 cites·22 claims
- 2940US2004061220A1Semiconductor device and manufacturing method thereofFiled 2003·Application pending·0 cites
- 3037US2007096332A1Electronic component, module, module assembling method, module identification method and module environment setting methodSATOH TOMOTOSHI·Filed 2004·Application pending·0 cites
- 3130US6029523APressure sensorMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 29, 2000·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →